期刊
PHOTONICS
卷 9, 期 1, 页码 -出版社
MDPI
DOI: 10.3390/photonics9010040
关键词
modulator; silicon photonics; bonding; III-V materials; EAM; EML
类别
资金
- Science Foundation Ireland (SFI) through the Irish Photonic Integration Centre (IPIC) [SFI-12/RC/2276_P2]
The article reviews current research on silicon photonics, with a focus on silicon modulator types and integration approaches. An analysis of state of the art silicon modulators is provided, along with exploration of prospects for III-V-silicon integration and investigation into the compatibility of an integrated modulator with current CMOS processing.
The article below presents a review of current research on silicon photonics. Herein, an overview of current silicon modulator types and modern integration approaches is presented including direct bonding methods and micro-transfer printing. An analysis of current state of the art silicon modulators is also given. Finally, new prospects for III-V-silicon integration are explored and the prospects of an integrated modulator compatible with current CMOS processing is investigated.
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