4.5 Article

Modulators in Silicon Photonics-Heterogenous Integration & and Beyond

期刊

PHOTONICS
卷 9, 期 1, 页码 -

出版社

MDPI
DOI: 10.3390/photonics9010040

关键词

modulator; silicon photonics; bonding; III-V materials; EAM; EML

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资金

  1. Science Foundation Ireland (SFI) through the Irish Photonic Integration Centre (IPIC) [SFI-12/RC/2276_P2]

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The article reviews current research on silicon photonics, with a focus on silicon modulator types and integration approaches. An analysis of state of the art silicon modulators is provided, along with exploration of prospects for III-V-silicon integration and investigation into the compatibility of an integrated modulator with current CMOS processing.
The article below presents a review of current research on silicon photonics. Herein, an overview of current silicon modulator types and modern integration approaches is presented including direct bonding methods and micro-transfer printing. An analysis of current state of the art silicon modulators is also given. Finally, new prospects for III-V-silicon integration are explored and the prospects of an integrated modulator compatible with current CMOS processing is investigated.

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