4.7 Article

A three-dimensional thermal management study for cooling a square Light Edding Diode

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ELSEVIER
DOI: 10.1016/j.csite.2021.101223

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Square LED; Electronics cooling; Heat sink; Variable heat convection coefficient; Junction temperature; Comsol multiphysics

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This study uses a three-dimensional, time-dependent code to simulate the thermal management of square LED lamps and finds that drilling holes in the heat sink can reduce the junction temperature of the LED lamp. The role of the convection heat transfer coefficient is crucial in ensuring good heat dissipation and cooling of the lamp by increasing the internal exchange surface.
This paper is intended to ensure adequate thermal management to extract and dissipate the heat emitted by a square Light Emitting Diode (LED) and to guarantee efficient and safe operation. Towards this aim, we developed a three-dimensional, time-dependent code that uses Comsol Multiphysics to solve the equation systems for mass, momentum, and energy. After the validation of this model, it is used to find an inexpensive solution to decrease the junction temperature of the square LED lamp. The drilling of the heat sink in square or circular form is the subject of this paper. For a precise study, the calculation of the convection heat transfer coefficient was calculated carefully according to all the necessary parameters. It is found that the junction temperature of the square LED lamp decreases by drilling the heat sink with two square or cylindrical shapes at different input powers. In addition, the role of the convection heat transfer coefficient is very important with the increase of internal exchange surface for good heat dissipation to the outside and cooling of the lamp.

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