相关参考文献
注意:仅列出部分参考文献,下载原文获取全部文献信息。A Survey of Powertrain Technologies for Energy-Efficient Heavy-Duty Machinery
Zhongyi Quan et al.
PROCEEDINGS OF THE IEEE (2021)
Direct Phase-Change Cooling of Vapor Chamber Integrated With IGBT Power Electronic Module for Automotive Application
Yiyi Chen et al.
IEEE TRANSACTIONS ON POWER ELECTRONICS (2021)
Jet Impingement Cooling in Power Electronics for Electrified Automotive Transportation: Current Status and Future Trends
Samantha Jones-Jackson et al.
IEEE TRANSACTIONS ON POWER ELECTRONICS (2021)
System-Level Reliability Assessment of Short Duty Electric Drives for Aerospace
Vincenzo Madonna et al.
IEEE TRANSACTIONS ON TRANSPORTATION ELECTRIFICATION (2021)
Battery warm-up methodologies at subzero temperatures for automotive applications: Recent advances and perspectives
Xiaosong Hu et al.
PROGRESS IN ENERGY AND COMBUSTION SCIENCE (2020)
Comparison of Single-Phase Convection in Additive Manufactured Versus Traditional Metal Foams
Justin Broughton et al.
JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME (2020)
Design, Analysis, Comparison, and Experimental Validation of Insulated Metal Substrates for High-Power Wide-Bandgap Power Modules
Emre Gurpinar et al.
JOURNAL OF ELECTRONIC PACKAGING (2020)
Power Electronic Converters in Electric Aircraft: Current Status, Challenges, and Emerging Technologies
Lea Dorn-Gomba et al.
IEEE TRANSACTIONS ON TRANSPORTATION ELECTRIFICATION (2020)
A Comprehensive Review on the Core Thermal Management Improvement Concepts in Power Electronics
Sina Lohrasbi et al.
IEEE ACCESS (2020)
Automotive Power Module Packaging: Current Status and Future Trends
Yuhang Yang et al.
IEEE ACCESS (2020)
Thermal management system with different configuration liquid vapor chambers for high power electronic devices
Songkran Wiriyasart et al.
CASE STUDIES IN THERMAL ENGINEERING (2020)
Performance Evaluation of High-Power SiC MOSFET Modules in Comparison to Si IGBT Modules
Lei Zhang et al.
IEEE TRANSACTIONS ON POWER ELECTRONICS (2019)
Embedded cooling with 3D manifold for vehicle power electronics application: Single-phase thermal-fluid performance
Ki Wook Jung et al.
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER (2019)
Design of an Area-Scalable Two-Layer Evaporator Wick for High-Heat-Flux Vapor Chambers
Srivathsan Sudhakar et al.
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY (2019)
Automotive Traction Inverters: Current Status and Future Trends
John Reimers et al.
IEEE TRANSACTIONS ON VEHICULAR TECHNOLOGY (2019)
Review and Trends of Thermoelectric Generator Heat Recovery in Automotive Applications
Romina Rodriguez et al.
IEEE TRANSACTIONS ON VEHICULAR TECHNOLOGY (2019)
Area-scalable high-heat-flux dissipation at low thermal resistance using a capillary-fed two-layer evaporator wick
Srivathsan Sudhakar et al.
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER (2019)
Impact of Cooling System Capacity on Lifetime of Power Module in Adjustable Speed Drives
Ui-Min Choi et al.
IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS (2019)
Reliability Improvement of a Double-Sided IGBT Module by Lowering Stress Gradient Using Molybdenum Buffers
Meiyu Wang et al.
IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS (2019)
Near-junction cooling for next-generation power electronics
Feng Zhou et al.
INTERNATIONAL COMMUNICATIONS IN HEAT AND MASS TRANSFER (2019)
Wide Bandgap Devices in AC Electric Drives: Opportunities and Challenges
Ajay Kumar Morya et al.
IEEE TRANSACTIONS ON TRANSPORTATION ELECTRIFICATION (2019)
Present and future thermal interface materials for electronic devices
Kafil M. Razeeb et al.
INTERNATIONAL MATERIALS REVIEWS (2018)
Improved resistance to thermal fatigue of active metal brazing substrates for silicon carbide power modules using tough silicon nitrides with high thermal conductivity
Hiroyuki Miyazaki et al.
CERAMICS INTERNATIONAL (2018)
Bus Bar Design for High-Power Inverters
Alan Dorneles Callegaro et al.
IEEE TRANSACTIONS ON POWER ELECTRONICS (2018)
Embedded Two-Phase Cooling of High Flux Electronics Via Press-Fit and Bonded FEEDS Coolers
Raphael K. Mandel et al.
JOURNAL OF ELECTRONIC PACKAGING (2018)
Review of Thermal Packaging Technologies for Automotive Power Electronics for Traction Purposes
Justin Broughton et al.
JOURNAL OF ELECTRONIC PACKAGING (2018)
Thermal Management on IGBT Power Electronic Devices and Modules
Cheng Qian et al.
IEEE ACCESS (2018)
Recent Developments in Thermal Management of Electrified Powertrains
Antti Lajunen et al.
IEEE TRANSACTIONS ON VEHICULAR TECHNOLOGY (2018)
Electrical Power Generation in Aircraft: Review, Challenges, and Opportunities
Vincenzo Madonna et al.
IEEE TRANSACTIONS ON TRANSPORTATION ELECTRIFICATION (2018)
Review of Silicon Carbide Power Devices and Their Applications
Xu She et al.
IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS (2017)
A review of high-temperature proton exchange membrane fuel cell (HT-PEMFC) system
R. E. Rosli et al.
INTERNATIONAL JOURNAL OF HYDROGEN ENERGY (2017)
Comprehensive Topological Overview of Rolling Stock Architectures and Recent Trends in Electric Railway Traction Systems
Deepak Ronanki et al.
IEEE TRANSACTIONS ON TRANSPORTATION ELECTRIFICATION (2017)
Two-phase jet impingement cooling for high heat flux wide band-gap devices using multi-scale porous surfaces
Shailesh N. Joshi et al.
APPLIED THERMAL ENGINEERING (2017)
Heat Management in Power Converters: From State of the Art to Future Ultrahigh Efficiency Systems
Eduardo Laloya et al.
IEEE TRANSACTIONS ON POWER ELECTRONICS (2016)
Reliability modeling of Sn-Ag transient liquid phase die-bonds for high-power SiC devices
Adeel Ahmad Bajwa et al.
MICROELECTRONICS RELIABILITY (2016)
Thermal Evaluation of Chip-Scale Packaged Gallium Nitride Transistors
David Reusch et al.
IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS (2016)
Past, Present, and Future Challenges of the Marine Vessel's Electrical Power System
Espen Skjong et al.
IEEE TRANSACTIONS ON TRANSPORTATION ELECTRIFICATION (2016)
Industrial waste heat recovery technologies: An economic analysis of heat transformation technologies
Sarah Brueckner et al.
APPLIED ENERGY (2015)
Multi-objective optimization of water-cooled pinfin heatsinks
Keisuke Horiuchi et al.
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER (2015)
Effect of sub-cooling on performance of a multi-jet two phase cooler with multi-scale porous surfaces
Shailesh N. Joshi et al.
INTERNATIONAL JOURNAL OF THERMAL SCIENCES (2015)
Topology Optimization, Additive Layer Manufacturing, and Experimental Testing of an Air-Cooled Heat Sink
Ercan M. Dede et al.
JOURNAL OF MECHANICAL DESIGN (2015)
Power Dense and Robust Traction Power Inverter for the Second-Generation Chevrolet Volt Extended-Range EV
Mohammad Anwar et al.
SAE INTERNATIONAL JOURNAL OF ALTERNATIVE POWERTRAINS (2015)
A Phase-Leg Power Module Packaged With Optimized Planar Interconnections and Integrated Double-Sided Cooling
Zhenxian Liang et al.
IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS (2014)
Two-Phase Liquid Cooling for Thermal Management of IGBT Power Electronic Module
Peng Wang et al.
JOURNAL OF ELECTRONIC PACKAGING (2013)
THERMO-ELECTRICAL CO-DESIGN OF THREE-DIMENSIONAL INTEGRATED CIRCUITS: CHALLENGES AND OPPORTUNITIES
Avram Bar-Cohen et al.
COMPUTATIONAL THERMAL SCIENCES (2013)
Ageing and Failure Modes of IGBT Modules in High-Temperature Power Cycling
Vanessa Smet et al.
IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS (2011)
Predictive Analytical Thermal Stress Modeling in Electronics and Photonics
E. Suhir
APPLIED MECHANICS REVIEWS (2009)
Thermal performance study of integrated cold plate with power module
Y. P. Zhang et al.
APPLIED THERMAL ENGINEERING (2009)
Thermal fatigue and failure of electronic power device substrates
S. Pietranico et al.
INTERNATIONAL JOURNAL OF FATIGUE (2009)
Selected failure mechanisms of modern power modules
M Ciappa
MICROELECTRONICS RELIABILITY (2002)