4.5 Article

Numerical Study of Thermal Shock Damage Mechanism of Polycrystalline Ceramics

期刊

FRONTIERS IN MATERIALS
卷 8, 期 -, 页码 -

出版社

FRONTIERS MEDIA SA
DOI: 10.3389/fmats.2021.724377

关键词

thermal shock; grain size; grain boundaries; simulation; energy dissipation

资金

  1. National Key R&D Program of China [2017YFB0703200]
  2. National Natural Science Foundation of China [51702100, 51972268]
  3. China Postdoctoral Science Foundation [2018M643075]

向作者/读者索取更多资源

A dual-scale model was proposed to study the effect of microstructure parameters on the thermal shock damage mechanism of alumina. By simulating crack nucleation and propagation, it was found that decreasing grain size and increasing grain boundary fracture energy have a positive effect on improving thermal shock resistance.
A dual-scale model is proposed to study the effect of microstructure parameters (grain size and grain boundary fracture energy) on the thermal shock damage mechanism on an example of alumina. At microscale, representative volume element (RVE) models generated by Voronoi tessellation are simulated to obtain the mechanical parameters for macro models. At macroscale, a coupled thermomechanical model based on the finite-discrete element method (FDEM) is applied to simulate the crack nucleation and propagation. Energy dissipation (ALLDMD) is introduced to investigate the thermal shock cracking mechanism by combining crack patterns and crack density, which indicates that decreasing grain size and increasing grain boundary fracture energy have a positive effect on thermal shock resistance. The proposed models not only predict the critical stress temperature which is well consistent to the theoretical thermal shock resistance factor, but also quantify the two previously unconsidered stages (crack nucleation and crack instability stage). Our models suggest the crack nucleation and instability will not occur immediately when the model reaches critical stress, but the models can sustain for higher temperature difference. The thermal shock damage mechanism and the influence of microstructural parameters on thermal shock resistance have also been discussed in detail.

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