Enhanced Thermal Conductivity of Polymer Composite by Adding Fishbone-like Silicon Carbide

The rapid development of chip technology has all put forward higher requirements for highly thermally conductive materials. In this work, a new type of material of Fishbone-like silicon carbide (SiC) material was used as the filler in a polyvinylidene fluoride (PVDF) matrix. The silicon carbide/polyvinylidene fluoride (SiC/PVDF) composites were successfully prepared with different loading by a simple mixing method. The thermal conductivity of SiC/PVDF composite reached 0.92 W m(-1) K-1, which is 470% higher than that of pure polymer. The results show that using the filler with a new structure to construct thermal conductivity networks is an effective way to improve the thermal conductivity of PVDF. This work provides a new idea for the further application in the field of electronic packaging.

Automated summary

In this study, Fishbone-like silicon carbide material was used as a filler to prepare SiC/PVDF composites with significantly increased thermal conductivity. Constructing thermal conductivity networks with fillers of new structures is an effective way to enhance the thermal conductivity of PVDF.