4.6 Article

Tuning of the elastic modulus of a soft polythiophene through molecular doping

期刊

MATERIALS HORIZONS
卷 9, 期 1, 页码 433-443

出版社

ROYAL SOC CHEMISTRY
DOI: 10.1039/d1mh01079d

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资金

  1. Swedish Research Council [2018-03824, 2016-05990]
  2. Knut and Alice Wallenberg Foundation through a Wallenberg Academy Fellowship Prolongation grant
  3. project Mastering Morphology of Solution-Borne Electronics''
  4. U.S. National Science Foundation [DMR-1921854]
  5. U.S. Army Research Office [W911NF19-2-0026]
  6. Vinnova [2018-03824] Funding Source: Vinnova
  7. Swedish Research Council [2018-03824] Funding Source: Swedish Research Council

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Molecular doping of polythiophene with oligoethylene glycol side chains significantly enhances both the electrical and mechanical properties of the polymer. This doping method influences the glass transition temperature and pi-stacking of the polymer, with multivalent counterions showing little effect on stiffness at comparable oxidation levels. These findings suggest that molecular doping is a powerful tool for designing mechanically robust conducting materials for flexible and stretchable electronics.
Molecular doping of a polythiophene with oligoethylene glycol side chains is found to strongly modulate not only the electrical but also the mechanical properties of the polymer. An oxidation level of up to 18% results in an electrical conductivity of more than 52 S cm(-1) and at the same time significantly enhances the elastic modulus from 8 to more than 200 MPa and toughness from 0.5 to 5.1 MJ m(-3). These changes arise because molecular doping strongly influences the glass transition temperature T-g and the degree of pi-stacking of the polymer, as indicated by both X-ray diffraction and molecular dynamics simulations. Surprisingly, a comparison of doped materials containing mono- or dianions reveals that - for a comparable oxidation level - the presence of multivalent counterions has little effect on the stiffness. Evidently, molecular doping is a powerful tool that can be used for the design of mechanically robust conducting materials, which may find use within the field of flexible and stretchable electronics.

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