期刊
ADVANCED MATERIALS INTERFACES
卷 9, 期 10, 页码 -出版社
WILEY
DOI: 10.1002/admi.202102266
关键词
aniline; conductive fabric; electromagnetic interference shielding; liquid metal; MXene
This study develops an effective strategy to construct a conductive titanium carbide/polyaniline composite and incorporates liquid metal nanoparticles to enhance conductivity and stability. A flexible, stable, and efficient electromagnetic interference shielding conductive composite fabric is fabricated using carbon fabrics as the substrate, with excellent shielding efficiency and other important properties.
Conductive fabrics are promising candidates for developing flexible, lightweight, and high conductivity electromagnetic (EM) shielding materials to meet the requirements of next-generation flexible and wearable electronics. Herein, an effective strategy to construct a conductive titanium carbide (Ti3C2Tx)/Polyaniline (PANI) composite with 3D nanoflower structure by deposition of PANI on the surface of single-layer Ti3C2Tx nanosheets through in situ and oxidant-free polymerization of aniline monomer to avoid the restacking/aggregation and easy oxidation of Ti3C2Tx MXene is developed. In addition, GaIn liquid metal (LM) nanoparticles are also incorporated into the Ti3C2Tx/PANI microsphere to increase conductivity and stability. This method solves the existing problems of poor connectivity between LM nanoparticles and discontinuity of the Ti3C2Tx MXene nanosheets. Eventually, by using carbon fabrics (CF) as the substrate, a flexible, stable, and efficient electromagnetic interference (EMI) shielding conductive composite fabric with an optimal EMI shielding efficiency (EMI SE) value of 52.0 dB in the range of 8.2-12.4 GHz at a thickness of 0.27 mm is developed. Meanwhile, the as-prepared fabrics demonstrate superior Joule heating property, high mechanical flexibility, and excellent bending-release stability. The study provides a simple and efficient method to fabricate multifunctional conductive textiles to meet the need for practical application in EMI shielding area.
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