期刊
JOURNAL OF MATERIALS CHEMISTRY C
卷 10, 期 1, 页码 44-72出版社
ROYAL SOC CHEMISTRY
DOI: 10.1039/d1tc04702g
关键词
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资金
- Foundation and Applied Basic Research Fund project of Guangdong Province [2019A151 5111034]
- Shenzhen basic research plan [JCYJ201908071 54409372]
- Shenzhen Post-doctoral Funding [E19106]
- National Natural Science Foundation of China [52103090]
This review focuses on the recent research progress in electromagnetic interference (EMI) shielding materials, especially in response to the increasing demand from 5G communication technology and modern electronic products. It discusses the structural design, properties, and testing technologies for EMI shielding effectiveness, as well as the impact of various carbon materials on shielding performance. The review also explores the application of near-field shielding in electronic packaging and presents the main challenges and outlook for future research in EMI shielding materials.
The rapid development of electronic equipment and the sharp increase in the demand for wireless communication have resulted in a substantial increase in electromagnetic pollution. Consequently, electromagnetic interference (EMI) shielding materials have been developed to solve the grim problem of electromagnetic pollution. However, 5G communication technology and modern electronic products demand shielding materials with higher requirements in terms of EMI shielding performance, weight, flexibility, and reliability. This review focuses on the recent research progress in the structural design, characterization, and properties of various EMI shielding materials including metal type, carbon type, and MXene type. The basic theory of EMI shielding is introduced in detail and the current testing technologies for EMI shielding effectiveness are summarized, which can help elucidate the structural design principles for shielding materials. The effect of different types of carbon materials, which are classified as zero-dimensional, one-dimensional, two-dimensional, and three-dimensional, on the shielding performance, and the corresponding shielding mechanism are discussed. Moreover, near-field shielding and its application in the field of electronic packaging are introduced. Based on our comprehensive analysis, we present the main challenges and outlook of EMI shielding materials in future research.
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