期刊
MATERIALS
卷 15, 期 1, 页码 -出版社
MDPI
DOI: 10.3390/ma15010108
关键词
copper pillar; electromigration; grain orientation; IMC accumulation; preferred orientation
类别
资金
- Natural Science Foundation of China Youth Foundation [62004046]
- foundation of Science and Technology on Reliability Physics and Application Technology of Electronic Component Laboratory [61428060201, 61428060102-1]
- Natural Science Foundation of Guangdong Province [2019A1515011844]
- Opening Project of Science and Technology on Reliability Physics and Application Technology of Electronic Component Laboratory [ZHD201801, 31512050201]
- [61428060102-1and]
The grain orientation of Sn-based solder joints on copper pillars plays a significant role in electromigration damage, with different orientations affecting Cu diffusion, IMC accumulation, and Cu6Sn5 formation. The study highlights the importance of grain orientation in governing electromigration behaviors in lead-free solder joints.
The grain orientation of Sn-based solder joints on copper pillars under the combined action of electron wind force and temperature gradient greatly affects their electromigration damage. The copper pillars with Sn-1.8Ag lead-free solder on the top was subjected to a current density of 1.5 x 10(4) A/cm(2) at 125 degrees C to study the electromigration behaviors. The grain orientation was characterized by scanning electron microscopy (SEM) equipped with electron backscattered diffraction (EBSD) detector. Metal dissolution and voids formation in the cathode as well as massive intermetallic compounds(IMC) accumulation in the anode were observed after electromigration. Closer examination of solder joints revealed that the Sn grain whose c-axis perpendicular to electric current may have retarded Cu diffusion to anode and IMC accumulation. In addition, the newly formed Cu6Sn5 exhibited preferred orientation related to the electric current direction.
作者
我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。
推荐
暂无数据