期刊
EUROPEAN PHYSICAL JOURNAL PLUS
卷 136, 期 11, 页码 -出版社
SPRINGER HEIDELBERG
DOI: 10.1140/epjp/s13360-021-02113-4
关键词
-
In this study, the numerical simulation of coolant flow in the CPU heat sink with micro-pin fins was conducted using ANSYS-Fluent. Different inlet-outlet configurations were studied, showing that an increase in Reynolds number leads to higher Nusselt number and lower skin friction along the heat sink surface.
In this study, the simulation of the coolant flow using micro-pin fins in the CPU heat sink was numerically presented with ANSYS-Fluent, a Computational Fluid Dynamics (CFD) program. Four different inlet-outlet configurations were employed in the heat sink. Keeping the inlet position of the flow to the heat sink fixed, the effects of the outlet position change on the pressure drop and thermal performance were examined. The flow field and heat transfer of each case were simulated with the SST k-omega turbulence model, three-dimensional study of steady, incompressible flow. In the study, a 2 mm diameter copper tube was used in the staggered arrangement fins array with the 0.23 porosity value. Reynolds number was in the range of 5000 < Re < 12,000 and 2 kW/m(2) constant heat flux to the cooling base was taken into consideration boundary conditions. Velocity streamlines, TKE and temperature distributions, Nusselt number (Nu), skin friction values (f), pressure drop (Delta P), thermal resistance (R-th) and performance criterion (PEC) changes were presented to detail the hydrodynamic and thermal performance characteristics along the heat sink surface with the increase of Reynolds number. Results showed that as the Reynolds number increased, Nusselt number increased and skin friction decreased. In addition to the improvement in heat transfer for the finned models considered according to the finless cooler, the results show that the input-output configurations make a minimum difference of 32.25% in the performance criteria. The significance and novelty of this investigation consist in a consideration of an electronic devices cooling system, as well as an assessment of the influence of inlet/outlet configuration on the cooling process for a CPU.
作者
我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。
推荐
暂无数据