A novel preform compaction method for fabricating high-performance Y-Ba-Cu-O single-grain bulk superconductor

A novel preform compaction method based on one new type of divisible mould was employed for fabricating single-grain YBCO bulk superconductor, which can complete the preform demoulding process through opening of the mould, rather than pushing the preform out in the regular mould. Thus it has natural superiority on eliminating macro-cracks, which has been proved by the sample surface morphology and the trapped field characterization. In addition, the divisible mould pressed sample exhibits higher levitation force and trapped field properties than the regular mould pressed samples, verifying the potentials of the divisible mould on improving the bulk performance. The optical micrograph results prove the superiority of the divisible mould on eliminating tiny cracks on sample surface. The processing facility and sample reliability brought by the divisible mould should also be emphasized, because the crushing and re-pressing of preform when it presents visible cracks can be omitted and the failed samples with surface cracks will no longer appear. Consequently, the experimental efficiency and stability are both enhanced.

Automated summary

A novel preform compaction method based on a new type of divisible mould was employed for fabricating single-grain YBCO bulk superconductor. The divisible mould has natural superiority in eliminating macro-cracks and tiny cracks, as demonstrated by sample surface morphology and trapped field characterization. In addition, the divisible mould pressed sample exhibits higher levitation force and trapped field properties, indicating its potential to improve the bulk performance. The processing facility and sample reliability brought by the divisible mould are also highlighted, resulting in enhanced experimental efficiency and stability.