Transient thermal finite-element analysis of fused filament fabrication process

Purpose The thermal behavior at the interfaces (of the deposited strands) during fused filament fabrication (FFF) technique strongly influences bond formation and it is a time- and temperature-dependent process. The processing parameters affect the thermal behavior at the interfaces and the purpose of the paper is to simulate using temperature-dependent (nonlinear) thermal properties rather than constant properties. Design/methodology/approach Nonlinear temperature-dependent thermal properties are used to simulate the FFF process in a simulation software. The finite-element model is first established by comparing the simulation results with that of analytical and experimental results of acrylonitrile butadiene styrene and polylactic acid. Strand temperature and time duration to reach critical sintering temperature for the bond formation are estimated for one of the deposition sequences. Findings Temperatures are estimated at an interface and are then compared with the experimental results, which shows a close match. The results of the average time duration (time to reach the critical sintering temperature) of strands with the defined deposition sequences show that the first interface has the highest average time duration. Varying processing parameters show that higher temperatures of the extruder and envelope along with higher extruder diameter and lower convective heat transfer coefficient will have more time available for bonding between the strands. Originality/value A novel numerical model is developed using temperature-dependent (nonlinear) thermal properties to simulate FFF processes. The model estimates the temperature evolution at the strand interfaces. It helps to evaluate the time duration to reach critical sintering temperature (temperature above which the bond formation occurs) as it cools from extrusion temperature.

Automated summary

This study simulates the fused filament fabrication (FFF) process using temperature-dependent thermal properties and investigates the effects of processing parameters on interface temperature and bond formation time. The results show that the first interface has the longest bond formation time, and higher temperatures of the extruder and envelope, larger extruder diameter, and lower convective heat transfer coefficient can increase the bond formation time.