相关参考文献
注意：仅列出部分参考文献，下载原文获取全部文献信息。Fabrication of high-performance nickel/graphene oxide composite coatings using ultrasonic-assisted electrodeposition
Honggang Zhang et al.
ULTRASONICS SONOCHEMISTRY (2020)
Advances in precision micro/nano-electroforming: a state-of-the-art review
Honggang Zhang et al.
JOURNAL OF MICROMECHANICS AND MICROENGINEERING (2020)
Synergistic effect of surfactant and saccharin on dispersion and crystal refinement for electrodeposition of nanocrystalline nickel/graphene oxide composite
Honggang Zhang et al.
SURFACE & COATINGS TECHNOLOGY (2020)
Electrodeposition of Nickel/Graphene Oxide Particle Composite Coatings: Effect of Surfactants on Graphene Oxide Dispersion and Coating Performance
Honggang Zhang et al.
JOURNAL OF THE ELECTROCHEMICAL SOCIETY (2020)
Effect of Stirring on the Defect-Free Filling of Deep Through-Silicon Vias
Feng Wang et al.
IEEE ACCESS (2020)
Quantitative study of mass transfer in megasonic micro electroforming based on mass transfer coefficient: Simulation and experimental validation
Ming Zhao et al.
ELECTROCHIMICA ACTA (2019)
The key role of suppressor diffusion in defect-free filling of the through-silicon-via with high depth
Feng Wang et al.
JOURNAL OF MICROMECHANICS AND MICROENGINEERING (2019)
Effect of cetyl-trimethyl-ammonium-bromide (CTAB) and bis (3-sulfopropyl) disulfide (SPS) on the through-silicon-via (TSV) copper filling
Fuliang Wang et al.
MICROELECTRONIC ENGINEERING (2019)
Communication-Triphenylmethane-Based Leveler for Microvia Filling in Copper Super-Conformal Electroplating
Jiye Luo et al.
JOURNAL OF THE ELECTROCHEMICAL SOCIETY (2019)
Effect of via depth on the TSV filling process for different current densities
Feng Wang et al.
JOURNAL OF MICROMECHANICS AND MICROENGINEERING (2018)
Effects of pulse reverse electroforming parameters on the thickness uniformity of electroformed copper foil
Quoc-Dinh Cao et al.
TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING (2018)
Experimental Model Validation of High Aspect Ratio Through-Hole Filling by Additive-Assisted Copper Electrodeposition
M. T. Johnson et al.
JOURNAL OF THE ELECTROCHEMICAL SOCIETY (2017)
High-speed and high-quality TSV filling with the direct ultrasonic agitation for copper electrodeposition
Fuliang Wang et al.
MICROELECTRONIC ENGINEERING (2017)
Dynamic through-silicon-via filling process using copper electrochemical deposition at different current densities
Fuliang Wang et al.
SCIENTIFIC REPORTS (2017)
Numerical simulation of electro-deposition process influenced by force convection and migration of ions
M. Zahraei et al.
JOURNAL OF ELECTROANALYTICAL CHEMISTRY (2016)
Simulation and fabrication of two Cu TSV electroplating methods for wafer-level 3D integrated circuits packaging
Shuai Shi et al.
SENSORS AND ACTUATORS A-PHYSICAL (2013)
Elimination of nanovoids induced during electroforming of metallic nanostamps with high-aspect-ratio nanostructures by the pulse reverse current electroforming process
Jungjin Han et al.
JOURNAL OF MICROMECHANICS AND MICROENGINEERING (2012)
Two-dimensional simulations of ion concentration distribution in microstructural electroforming
Tsung-Hsun Tsai et al.
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY (2011)
Micro-electroforming under periodic vacuum-degassing and temperature-gradient conditions
P. M. Ming et al.
VACUUM (2009)
Research on bipolar pulse current electroforming in precision molds and dies
Hongyou Li et al.
TSINGHUA SCIENCE AND TECHNOLOGY (2009)
Fabricating HARMS by using megasonic assisted electroforming
Gang Liu et al.
MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS (2008)
High-aspect-ratio microstructural posts electroforming modeling and fabrication in LIGA process
H Yang et al.
MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS (2006)
Abrasive polishing assisted nickel electroforming process
D. Zhu et al.
CIRP ANNALS-MANUFACTURING TECHNOLOGY (2006)
Applications of LIGA technology to precision manufacturing of high-aspect-ratio micro-components and -systems: a review
CK Malek et al.
MICROELECTRONICS JOURNAL (2004)
Simulation of shape evolution during electrodeposition of copper in the presence of additive
M Georgiadou et al.
JOURNAL OF THE ELECTROCHEMICAL SOCIETY (2001)
分享论文
