期刊
NANOTECHNOLOGY
卷 33, 期 6, 页码 -出版社
IOP Publishing Ltd
DOI: 10.1088/1361-6528/ac328b
关键词
diffraction gratings; spin-on-carbon; EUV; diffractive optics; interference lithography; soft x-rays
This study reports on the fabrication and characterization of high-resolution gratings using spin-on-carbon underlayers. The results demonstrate that the bilayer gratings made of hydrogen silsesquioxane and spin-on-carbon exhibit excellent performance as a grating mask for extreme ultraviolet interference lithography. The diffraction efficiency of the gratings can be accurately measured by measuring the relative ratio of the dose-to-clear curves of the photoresist. The experimental results confirm the theoretical predictions and demonstrate the successful fabrication of line/space patterns using EUV-IL.
We report on the fabrication and characterization of high-resolution gratings with high efficiency in the extreme ultraviolet (EUV) and soft x-ray ranges using spin-on-carbon (SOC) underlayers. We demonstrate the fabrication of diffraction gratings down to 20 nm half-pitch (HP) on Si3N4 membranes with a bilayer of hydrogen silsesquioxane (HSQ) and spin-on-carbon and show their performance as a grating mask for extreme ultraviolet interference lithography (EUV-IL). High-resolution patterning of HSQ is possible only for thin films due to pattern collapse. The combination of this high-resolution resist with SOC circumvents this problem and enables the fabrication of high aspect ratio nanostructures. Rigorous coupled-wave analysis shows that the bilayer gratings exhibit higher diffraction efficiency than what is feasible with a grating made of HSQ. We also demonstrate a simple and accurate method to experimentally measure the diffraction efficiency of high-resolution gratings by measuring the relative ratio of the dose-to-clear curves of the photoresist. The measured diffraction efficiencies are in good agreement with the theoretically predicted values. Furthermore, we verify our calculations and measurements by printing line/space patterns in chemically amplified resists down to 10 nm HP with both HSQ and bilayer grating masks using EUV-IL. The improved diffraction efficiency of the bilayers is expected to have applications not only in gratings for interference lithography, but also in Fresnel zone plates and gratings for spectroscopy in the EUV and soft x-ray ranges.
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