4.6 Article

Effects of Alcell Lignin Methylolation and Lignin Adding Stage on Lignin-Based Phenolic Adhesives

期刊

MOLECULES
卷 26, 期 22, 页码 -

出版社

MDPI
DOI: 10.3390/molecules26226762

关键词

Alcell lignin; lignin methylolation; phenolic adhesives; lignin based phenolic adhesives

资金

  1. National Natural Science Foundation of China [51764019, 52004114]
  2. Agriculture and Agri-Food Canada (AAFC) through BioMass Canada (BMC)BioFuelNet cluster program-an Agri-Science Cluster
  3. NSERC

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The study investigated the effects of lignin methylolation and lignin adding stage on lignin-based phenolic adhesives. It was found that integrating lignin into phenolic adhesives significantly increased viscosity but did not affect thermal stability. Lignin-based phenolic adhesives showed higher bonding strength when laminated with three-ply plywoods.
To investigate the effects of lignin methylolation and lignin adding stage on the resulted lignin-based phenolic adhesives, Alcell lignin activated with NaOH (AL) or methylolation (ML) was integrated into the phenolic adhesives system by replacing phenol at various adhesive synthesis stages or directly co-polymerizing with phenolic adhesives. Lignin integration into phenolic adhesives greatly increased the viscosity of the resultant adhesives, regardless of lignin methylolation or adding stage. ML introduction at the second stage of adhesive synthesis led to much bigger viscosity than ML or AL introduction into phenolic adhesives at any other stages. Lignin methylolation and lignin adding stage did not affect the thermal stability of lignin based phenolic adhesives, even though lignin-based adhesives were less thermally stable than NPF. Typical three-stage degradation characteristics were also observed on all the lignin-based phenolic adhesives. Three-ply plywoods can be successfully laminated with lignin based adhesives, and it was interesting that after 3 h of cooking in boiling water, the plywoods specimens bonded with lignin-based phenolic adhesives displayed higher bonding strength than the corresponding dry strength obtained after direct conditioning at 20 & DEG;C and 65% RH. Compared with NPF, lignin introduction significantly reduced the bonding strength of lignin based phenolic adhesives when applied for plywood lamination. However, no significant variation of bonding strength was detected among the lignin based phenolic adhesives, regardless of lignin methylolation or adding stages.

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