Mechanical, thermal, and dielectric properties of SiCf/SiC composites reinforced with electrospun SiC fibers by PIP

Electrospun unidirectional SiC fibers reinforced SiCf/SiC composites (e-SiCf/SiC) were prepared with similar to 10% volume fraction by polymer infiltration and pyrolysis (PIP) process. Pyrolysis temperature was varied to investigate the changes in microstructures, mechanical, thermal, and dielectric properties of e-SiCf/SiC composites. The composites prepared at 1100 degrees C exhibit the highest flexural strength of 286.0 +/- 33.9 MPa, then reduced at 1300 degrees C, mainly due to the degradation of electmspun SiC fibers, increased porosity, and reactioncontrolled interfacial bonding. The thermal conductivity of e-SiCf/SiC prepared at 1300 degrees C reached 2.663 W/(m.K). The dielectric properties of e-SiCf/SiC composites were also investigated and the complex permittivities increase with raising pyrolysis temperature. The e-SiCf/SiC composites prepared at 1300 degrees C exhibited EMI shielding effectiveness exceeding 24 dB over the whole X band. The electrospun SiC fibers reinforced SiCf/SiC composites can serve as a potential material for structural components and EMI shielding applications in the future.

Automated summary

SiC fibers reinforced SiCf/SiC composites were prepared by electrospinning with varied pyrolysis temperatures to investigate their microstructures, mechanical, thermal, and dielectric properties. Composites prepared at 1300 degrees Celsius exhibited good thermal conductivity and electromagnetic shielding effectiveness, showing promise for structural components and EMI shielding applications in the future.