期刊
JOURNAL OF MICROMECHANICS AND MICROENGINEERING
卷 32, 期 1, 页码 -出版社
IOP Publishing Ltd
DOI: 10.1088/1361-6439/ac388d
关键词
screen printing; laser-induced; graphene powder; piezoresistive; asymmetric pressure sensor
类别
资金
- National Natural Science Foundation of China [51604157]
In this study, laser-induced graphene (LIG) powder is prepared into screen printing ink for the first time, enabling the fabrication of shape-controllable LIG patterned electrodes on various substrates using a facile screen printing process. The resulting flexible LIG screen-printed asymmetric pressure sensor exhibits excellent sensing properties, including high sensitivity, low detection limit, short response time, and long cycle durability.
Graphene-based pressure sensors have received extensive attention in wearable devices. However, reliable, low-cost, and large-scale preparation of structurally stable graphene electrodes for flexible pressure sensors is still a challenge. Herein, for the first time, laser-induced graphene (LIG) powder are prepared into screen printing ink, and shape-controllable LIG patterned electrodes can be obtained on various substrates using a facile screen printing process, and a novel asymmetric pressure sensor composed of the resulting screen-printed LIG electrodes has been developed. Benefit from the 3D porous structure of LIG, the as-prepared flexible LIG screen-printed asymmetric pressure sensor has super sensing properties with a high sensitivity of 1.86 kPa(-1), low detection limit of about 3.4 Pa, short response time, and long cycle durability. Such excellent sensing performances give our flexible asymmetric LIG screen-printed pressure sensor the ability to realize real-time detection of tiny body physiological movements (such as wrist pulse and pronunciation action). Besides, the integrated sensor array has a multi-touch function. This work could stimulate an appropriate approach to designing shape-controllable LIG screen-printed patterned electrodes on various flexible substrates to adapt the specific needs of fulfilling compatibility and modular integration for potential application prospects in wearable electronics.
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