4.7 Article

Multilayered graphene/boron nitride/thermoplastic polyurethane composite films with high thermal conductivity, stretchability, and washability for adjustable-cooling smart clothes

期刊

JOURNAL OF COLLOID AND INTERFACE SCIENCE
卷 599, 期 -, 页码 611-619

出版社

ACADEMIC PRESS INC ELSEVIER SCIENCE
DOI: 10.1016/j.jcis.2021.04.123

关键词

Thermal conductivity; Composite film; Polyurethane; Graphene nanoplatelet; Boron nitride

资金

  1. Ministry of Science and Technology of Taiwan [MOST 1082221E011042MY2]

向作者/读者索取更多资源

The study developed a multilayered composite film with high thermal conductivity and good durability by dispersing fillers in a polymer matrix. The composite film showed excellent performance in terms of thermal conductivity, flexural fatigue, and laundering, and also exhibited enhanced thermal stability, cooling, and hydrophobic properties.
Polymers having high filler loading levels are not able to meet the increasing requirements of thermal interface materials by themselves; therefore, fillers and structures with unique advantages have been developed. In this study, mechanical mixing was used to disperse graphene nanoplatelets (GNPs) and boron nitride (BN) fillers inside thermoplastic polyurethane (TPU)-based films, which were then compounded into a multilayered structure. The multilayered BN-GNP/TPU composite film created during this study exhibited a high thermal conductivity of 6.86 W m(-1) K-1 at a low filler loading of 20 wt% BN with 20 wt% GNP, which was significantly higher (2844%) than that of the neat TPU film. The composite film also had good durability to flexural fatigue and laundering. This was exhibited by maintaining thermal conductivity values of 6.25 W m(-1) K-1 after 5000 cycles of the flexural fatigue test, and 6.85 W m(-1) K-1 after 10 cycles of laundering, respectively. Furthermore, enhanced thermal stability, cooling, and hydrophobic properties of the multilayered BN-GNP/TPU composite films were also observed with the resulting composite film. Overall, such a system provides a facile approach that is applicable for the fabrication of multifunctional materials as thermal interface materials within smart cooling garments. (C) 2021 Elsevier Inc. All rights reserved.

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