Progress, challenges and potentials/trends of tungsten-copper (W-Cu) composites/pseudo-alloys: Fabrication, regulation and application

Tungsten-copper (W-Cu) composites/pseudo alloys with excellent properties are extremely desirable for applications as electrode materials, functional graded materials, electronic packaging materials, electrical contacts, as well as other aerospace and military candidates. This paper reviewed the recent progress on fabrication techniques, microstructure and property regulation that ensure high-performance W-Cu alloys. Besides the well-developed traditional powder metallurgy including the parameter modification, powder pre-treatment and severe plastic deformation post-treatment, extensive novel sintering or manufacturing techniques including microwave sintering, spark plasma sintering, field-assisted sintering and additive manufacturing of W-Cu alloys are reviewed, along with various chemical methods for nano-powder synthesis. Subsequently, the microstructure and property regulation by pure metal elements and introduction of second phases with great details are provided. Based on the review with all-sided perspectives for W-Cu alloys, future developments and potential research challenges for W-Cu alloys are summarized and proposed finally.

Automated summary

Tungsten-copper (W-Cu) composites/pseudo alloys are highly desired for various applications and recent studies have focused on their fabrication techniques, microstructure, and property regulation. The review covers traditional powder metallurgy, novel sintering/manufacturing techniques, chemical methods for nano-powder synthesis, and microstructure and property regulation by introducing pure metal elements and second phases. Future developments and potential research challenges for W-Cu alloys are also highlighted.