期刊
INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE
卷 173, 期 -, 页码 -出版社
ELSEVIER SCI LTD
DOI: 10.1016/j.ijmachtools.2021.103848
关键词
Additive electrochemical micro-manufacturing; Electrochemical additive manufacturing; Electrochemical deposition; Through-mask electroplating; EFAB; LECD
资金
- National Natural Science Foundation of China [51875178]
- Key Scientific and Technological Program of Henan Province [202102210069]
- Chinese Civil Aviation Administration [U1933129]
Additive electrochemical micro-manufacturing (micro-AECM) is a nontraditional fabrication method that uses electrochemical deposition to manufacture metal-based microstructures layer by layer. It has the advantages of accurate geometric replication, void-free and crack-free microstructures, and is a true additive manufacturing technology. Several micro-AECM techniques have been developed and commercially implemented. This paper introduces the fundamental schematic of electrochemical deposition related to micro-AECM, reviews several typical micro-AECM techniques, and discusses the challenges, development trends and perspectives in micro-AECM.
Additive electrochemical micro-manufacturing (micro-AECM) is a nontraditional fabrication method which fundamentally employs electrochemical deposition (ECD) mechanism in different forms to manufacture metal based microstructures layer-upon-layer. Micro-AECM based on traditional mask-based ECD has long been widely adopted to manufacture large scale precision two-dimensional (2D) and quasi-three-dimensional (quasi 3D or 2.5D) metallic micro-sized geometries by inversely duplicating the photoresist though-masks patterned lithographically. Recently, micro-AECM has attracted increasing attention owing to its significant potential advantages in producing 3D complex void-free and crack-free microstructures with a favorable surface finish and now has emerged as a true additive micro-manufacturing (electrochemical additive manufacturing) technology based on ultrafine anode/electrolyte-jet-induced ECD (maskless micro-AECM). To date, several micro-AECM techniques have been developed to meet versatile applications, and some of them have already been used commercially. In this paper, the fundamental schematic of ECD closely related to micro-AECM is introduced, and several typical micro-AECM techniques are reviewed, including through-mask electroplating, instant masking (IM) plating, electrochemical fabrication (EFAB), localized electrodeposition (LECD), jet electrochemical deposition (Jet ECD), meniscus-confined electroplating (MCED), electrohydrodynamic redox printing (EHD-RP), tip based nanofabrication (TBN), and fluidic force microscope electrodeposition (FluidFM electrodeposition). Furthermore, the challenges, development trends and perspectives of micro-AECM are discussed.
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