4.7 Article

In-situ surface nanoetching WO3 photoanode for enhanced photoelectrochemical performance

期刊

INTERNATIONAL JOURNAL OF HYDROGEN ENERGY
卷 47, 期 22, 页码 11552-11560

出版社

PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.ijhydene.2022.01.180

关键词

Photoelectrochemical; WO3; Surface nanoetching; Water splitting

资金

  1. National Natural Science Foundation of China [21808051, 52073087]
  2. China Postdoctoral Science Foundation [2020M682582]
  3. Key Research and Development Program of Hunan province [2019GK2237]
  4. Hunan Provincial Natural Science Foundation of China [2019JJ40288]
  5. Scientific Research Foundation of Education Bureau of Hunan Province of China [18B220]

向作者/读者索取更多资源

In this study, an in-situ surface nanoetching method was used to increase the surface area of WO3 nanosheet array film, leading to higher photocurrent density. This research provides a simple and effective method to further increase the surface area of nanoarray photoelectrodes.
Nanoarray films have received great attention in solar water splitting due to their high surface area and excellent photoelectrochemical (PEC) performance. However, it is difficult to further increase the surface area of the nanoarray film. In this work, we demonstrate an in-situ surface nanoetching method (WO3->WO3/Bi2WO6->WO3/Bi2S3->etching WO3) to increase surface area of WO3 nanosheet array film. The characterization results indicate rougher and more uneven surface of the etched WO3 (E-WO3) film compared with the pristine WO3 film. Moreover, the photocurrent density of E-WO3 film is about 0.40 mA cm-2 at 1.23 V (vs. RHE) under light illumination without cocatalyst, which is 2.7 times higher than that of pristine WO3 film. This may be due to an increased surface area of the E-WO3 photoanode, which provides more active sites for the catalytic reactions and accelerates the charge transfer. This research can provide a simple and effective method to further increase the surface area of the nanoarray photoelectrode. (c) 2022 Hydrogen Energy Publications LLC. Published by Elsevier Ltd. All rights reserved.

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