4.7 Article

Heat transfer investigation of a flat-plate oscillating heat pipe with tandem dual channels under nonuniform heating

出版社

PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.ijheatmasstransfer.2021.121830

关键词

Flat-plate oscillating heat pipe; Nonuniform heating; Tandem dual-channel structure; Multiple heat sources and sinks; Thermohydrodynamic performance

资金

  1. National Natural Science Foun-dation of China [51876184]
  2. Six-talent Peak Project of Jiangsu Province [JNHB-074]
  3. China Postdoctoral Science Foundation [2019T120469]
  4. Postgraduate Research & Practice In-novation Program of Jiangsu Province [SJCX20_0065]

向作者/读者索取更多资源

The study investigates the thermal performance of a novel tandem dual-channel flat-plate oscillating heat pipe under nonuniform heating conditions. It was found that nonuniform heating can improve thermohydrodynamic performance at low heat loads but worsen it at high heat loads. Concentrating more heat to overcome negative effects is more beneficial than amplifying positive effects for overall thermal performance.
To provide cooling of electronics under nonuniform heating from multiple heat sources, a novel tandem dual-channel flat-plate oscillating heat pipe (OHP) is tailored and experimentally studied with a center multiple-heat-source nonuniform heating and two-end air cooling layout under different inclination angles, heat loads and nonuniform heating levels. Flow pattern diagrams together with thermal resistance contour maps are organized for two tandem mirror-symmetric halves of the flat-plate OHP, and the thermal performance differences under nonuniform and uniform heating are compared. It is indicated that, compared with uniform heating, nonuniform heating produces better thermohydrodynamic performance at a low heat load with quasi-steady stop-oscillation fluid motion in the flat-plate OHP, while it results in poorer thermohydrodynamic performance when the heat load is large enough to maintain sustainable fluid flow in the flat-plate OHP. Under nonuniform heating conditions, concentrating more heat to overcome the negative effects rather than to amplify the positive effects on the fluid flow and heat transfer in OHPs is more beneficial to the overall thermal performance. For the 540 tested conditions, the flat-plate OHP has a much smaller overall thermal resistance than a pure 6063 aluminum alloy plate with the same configuration (approximately 15.3% on average) along a heat transfer distance of 101.8 mm. In addition, it possesses good adaptability to gravity, with coefficients of variation of 27.6% in the overall thermal resistance for inclination angles from 0 degrees to 90 degrees. Accordingly, this flat-plate OHP has good potential for high-efficiency and good-adaptability cooling of electronics under nonuniform heating by multiple heat sources. (c) 2021 Elsevier Ltd. All rights reserved.

作者

我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。

评论

主要评分

4.7
评分不足

次要评分

新颖性
-
重要性
-
科学严谨性
-
评价这篇论文

推荐

暂无数据
暂无数据