4.7 Article

Numerical modeling of effective thermal conductivity of hollow silica nanosphere packings

出版社

PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.ijheatmasstransfer.2021.122032

关键词

Hollow nanosphere; Nanoporous; Thermal conductivity; Thermal insulation; Numerical modeling

资金

  1. National Natural Science Foundation of China [51806200]
  2. Foundation of Key Laboratory of Thermo-Fluid Science and Engineering (Xi'an Jiaotong University), Ministry of Education [KLTFSE2020KFJJ03]
  3. Education Department of Henan Province [19A470010]
  4. Zhengzhou University of Light Industry [2019ZCKJ215]
  5. Research Council of Norway [250159, 245963/F50]

向作者/读者索取更多资源

Hollow silica nanosphere packings can suppress heat conduction significantly through voids, small interparticle contact areas, and nanosized pores, showing potential in energy-efficient building applications. Developing a numerical model considering geometric parameters can effectively reduce the thermal conductivity of HSNSPs.
Hollow silica nanosphere packings (HSNSPs) can significantly suppress heat conduction through solid and gas phases due to the voids, small interparticle contact areas, and nanosized pores, showing promising potentials towards energy-efficient building applications. The HSNSPs display a two-level structure, where the solid silica nanoparticles form the shells of hollow spheres, and the accretion of hollow spheres form the porous powder packing structures. Investigating thermal transport in HSNSPs helps to understand the fundamental thermal transport processes and to guide the design of their geometric structures. Herein, we developed a numerical model based on the two-level structure of HSNSPs to explore their effective thermal conductivities. The developed numerical model considers the geometric parameters such as sphere size, shell thickness, interparticle contact resistance, and the gas pressure inside and outside the hollow spheres. The developed numerical model was validated by the measured thermal conductivities of HSNSPs fabricated via the sacrificial template method. The results show that the effective thermal conductivity of HSNSPs can be reduced by decreasing sphere diameter, contact area and shell thickness. The influence of ratio of contact diameter to sphere diameter on the effective thermal conductivity becomes weaker as the hollow sphere size decreases (e.g., < 200 nm). Besides, we also show that reducing gas pressure outside the hollow spheres can effectively decrease the thermal conductivity of HSNSPs. This work provides a guideline for the structural design and optimization of HSNSPs. (c) 2021 Elsevier Ltd. All rights reserved.

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