A Review of Flexible Multilayer Foil Integration Technology for Passive Components

Passive integration technology is widely used in power electric converters since it can significantly reduce the volume of the passive components and improve the power density. This article highlights the flexible multilayer foil (FMLF) integration technology since it can meet the future requirements than other integration technologies. The realization, structures, and applications of the FMLF integration technology are summarized. The magnetic materials, dielectric materials, and conductive materials used in FMLF are investigated. Then, the approaches of the analysis and design for FMLF integrated units are introduced. Finally, it is compared with the planar printed circuit board integration technology to highlight the advantages of its characteristics and expounds its future research fields. Eventually, the power electronics engineers and researchers can comprehend the intrinsic properties of the FMLF integration technology.

Automated summary

Passive integration technology, particularly the flexible multilayer foil (FMLF) integration technology, is highlighted for its ability to reduce passive component volume and improve power density, surpassing other integration methods. The article summarizes the realization, structures, and applications of FMLF, investigates the materials used, and introduces analysis and design approaches. By comparing it with planar printed circuit board integration technology, the advantages of FMLF's characteristics are emphasized, shedding light on its future research fields for power electronics engineers and researchers.