4.3 Article

Self-Heating and Reliability-Aware Intrinsic Safe Operating Area of Wide Bandgap Semiconductors-An Analytical Approach

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IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TDMR.2021.3112389

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Power electronics; safe operating area; selfheating; reliability; thermal resistance; figure of merit

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This paper discusses the importance of developing unified principles to guide the development of wide bandgap semiconductors, proposing a comprehensive intrinsic safe operating area that optimizes trade-offs in advance. By comparing its predictions with experimental data, it provides a new perspective for evaluating the performance of power electronic devices.
The emergence of several technology options and the ever-broadening range of applications (e.g., automotive, smart grids, solar/wind farms) for power electronic devices suggest both a need and an opportunity to develop unifying principles to guide the development of wide bandgap (WBG) semiconductors. Unfortunately, power electronic devices are typically evaluated with a variety of elementary figure of merits (FOMs), which offer inconsistent/contradictory projections regarding the relative merits of emerging technologies. Indeed, one relies on the empirical (extrinsic) safe-operating area (SOA) of a packaged device to ultimately assess the performance potential of a technology option. Unfortunately, extrinsic SOA can only be calculated a posteriori, i.e., after precise measurement of the fabricated device parameters, making it suitable only for relatively mature technologies. Based on the insights of material-device-circuit-system performance analysis of a variety of idealized WBG power electronic devices (e.g., GaN HEMT, beta-Ga2O3 MOSFET), in this paper, we analytically derive a comprehensive, substrate-, selfheating-, and reliability-aware intrinsic/limiting safe operating area (SOA) that establishes a priori, i.e., before device fabrication, the optimum and self-consistent trade-off among breakdown voltage, power consumption, operating frequency, heat dissipation, and reliability. We establish the relevance of the intrinsic-SOA by comparing its prediction with a broad range of experimental data available in the literature. In between the traditional FOMs and extrinsic SOA, the intrinsic SOA allows fundamental/intuitive re-evaluation of intrinsic technology potential for power electronic devices and identifies specific performance bottlenecks and suggests strategies to circumvent them.

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