相关参考文献
注意:仅列出部分参考文献,下载原文获取全部文献信息。Scanning Acoustic Microscopy (SAM): A Robust Method for Defect Detection during the Manufacturing Process of Ultrasound Probes for Medical Imaging
Francesco Bertocci et al.
SENSORS (2019)
Efficiency, quality, and environmental impacts: A comparative study of residential artificial lighting
Danilo Ferreira de Souza et al.
ENERGY REPORTS (2019)
An Overview of Non-Destructive Testing Methods for Integrated Circuit Packaging Inspection
Pouria Aryan et al.
SENSORS (2018)
Performance of InGaN-Based Thin-Film LEDs With Flip-Chip Configuration and Concavely Patterned Surface Fabricated on Electroplating Metallic Substrate
Xiao-Long Hu et al.
IEEE PHOTONICS JOURNAL (2016)
Transient thermal analysis as measurement method for IC package structural integrity
Alexander Hanss et al.
CHINESE PHYSICS B (2015)
Development of high-efficiency and high-power vertical light emitting diodes
Berthold Hahn et al.
JAPANESE JOURNAL OF APPLIED PHYSICS (2014)
Analysis of the temperature dependence of the forward voltage characteristics of GaInN light-emitting diodes
David S. Meyaard et al.
APPLIED PHYSICS LETTERS (2013)
Automated inspection and classification of flip-chip-contacts using scanning acoustic microscopy
S. Brand et al.
MICROELECTRONICS RELIABILITY (2010)
High performance thin-film flip-chip InGaN-GaN light-emitting diodes
O. B. Shchekin et al.
APPLIED PHYSICS LETTERS (2006)
Junction temperature in ultraviolet light-emitting diodes
YG Xi et al.
JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS (2005)
Junction-temperature measurement in GaN ultraviolet light-emitting diodes using diode forward voltage method
Y Xi et al.
APPLIED PHYSICS LETTERS (2004)
On thermal diffusivity
A Salazar
EUROPEAN JOURNAL OF PHYSICS (2003)