4.8 Article

Short-Circuit Protection Circuits for Silicon-Carbide Power Transistors

期刊

IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS
卷 63, 期 4, 页码 1995-2004

出版社

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TIE.2015.2506628

关键词

Bipolar junction transistor (BJT); driver circuits; failure analysis; fault detection; fault protection; junction field-effect transistor (JFET); power MOSFET; semiconductor device reliability; short-circuit current; silicon carbide (SiC); wide-bandgap semiconductors

资金

  1. Alstom
  2. Swedish Energy Agency
  3. Vinnova

向作者/读者索取更多资源

An experimental analysis of the behavior under short-circuit conditions of three different silicon-carbide (SiC) 1200-V power devices is presented. It is found that all devices take up a substantial voltage, which is favorable for detection of short circuits. A transient thermal device simulation was performed to determine the temperature stress on the die during a short-circuit event, for the SiC MOSFET. It was found that, for reliability reasons, the short-circuit time should be limited to values well below Si IGBT tolerances. Guidelines toward a rugged design for short-circuit protection (SCP) are presented with an emphasis on improving the reliability and availability of the overall system. A SiC device driver with an integrated SCP is presented for each device-type, respectively, where a short-circuit detection is added to a conventional driver design in a simple way. The SCP driver was experimentally evaluated with a detection time of 180 ns. For all devices, short-circuit times well below 1 mu s were achieved.

作者

我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。

评论

主要评分

4.8
评分不足

次要评分

新颖性
-
重要性
-
科学严谨性
-
评价这篇论文

推荐

暂无数据
暂无数据