期刊
IEEE TRANSACTIONS ON ELECTRON DEVICES
卷 63, 期 10, 页码 4038-4045出版社
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TED.2016.2599854
关键词
Charge trapping; direct current IV (DCIV); high-k metal gate (HKMG); negative bias temperature instability (NBTI); positive bias temperature instability (PBTI); trap generation (TG); ultrafast measure stress measure (UF-MSM)
资金
- DEITY, Government of India
Degradation in planar high-k metal gate p-and n-channel MOSFETs, respectively, under negative bias temperature instability (NBTI) and positive bias temperature instability (PBTI) stress is studied using different characterization methods. Ultrafast measure stress measure (UF-MSM) method with a measurement delay of a few microseconds is used to characterize the threshold voltage shift (Delta V-T). Gated-diode or direct current IV is used to directly estimate the trap generation (TG) during BTI, after correcting for the measurement inconsistencies. BTI experiments are performed under DC stress at different stress bias (VG-STR) and temperature (T) values also under AC stress at different pulse duty cycle (PDC) and frequency (f) values. Measured Delta V-T as well as TG show remarkable similarities between NBTI and PBTI stress, under both DC and AC stress. It is shown that TG dominates NBTI and PBTI degradation under both DC and AC stress.
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