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A Review of Raman Thermography for Electronic and Opto-Electronic Device Measurement With Submicron Spatial and Nanosecond Temporal Resolution

期刊

出版社

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
DOI: 10.1109/TDMR.2016.2617458

关键词

Thermography; thermal simulation; GaN; GaAs; HEMT; thermal management; reliability

资金

  1. U.K. Engineering and Physical Sciences Research Council
  2. European Space Agency
  3. European Defense Agency
  4. U.S. Office for Naval Research
  5. Engineering and Physical Sciences Research Council [1505109] Funding Source: researchfish

向作者/读者索取更多资源

We review the Raman thermography technique, which has been developed to determine the temperature in and around the active area of semiconductor devices with submicron spatial and nanosecond temporal resolution. This is critical for the qualification of device technology, including for accelerated lifetime reliability testing and device design optimization. Its practical use is illustrated for GaN and GaAs-based high electron mobility transistors and opto-electronic devices. We also discuss how Raman thermography is used to validate device thermal models, as well as determining the thermal conductivity of materials relevant for electronic and opto-electronic devices.

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