4.7 Article

A simple and green strategy for preparing flexible thermoplastic polyimide foams with exceptional mechanical, thermal-insulating properties, and temperature resistance for high-temperature lightweight composite sandwich structures

期刊

COMPOSITES PART B-ENGINEERING
卷 228, 期 -, 页码 -

出版社

ELSEVIER SCI LTD
DOI: 10.1016/j.compositesb.2021.109405

关键词

Polyimide; Foam; Thermal properties; Flexible foam; Strength; Thermal insulation

资金

  1. National Natural Science Foundation of China [21905082]
  2. Natural Science Foundation of Heilongjiang Province [TD2020E003]

向作者/读者索取更多资源

The study successfully fabricated thermoplastic PI foams with excellent thermal-insulating properties and temperature resistance by linking flexible blocks into rigid polymeric structures through a simple aqueous strategy to construct hydrogen-bonding networks.
Polyimide (PI) foams possess excellent mechanical properties, high-temperature resistance, and other unique properties, which facilitate impact in aerospace, automotive, and microelectronics industries. However, when they are used as lightweight insulation structural layers for high-temperature carbon fiber reinforced composites, improvement in thermal-insulating properties and temperature resistance of PI foams without compromising the flexibility in extreme environments is a challenging task. In this study, the flexible blocks were linked into rigid polymeric structures to fabricate a thermoplastic structure through a simple aqueous strategy to construct hydrogen-bonding networks. Thus, with a low shrinkage of 8.42%, an ultrahigh compressive modulus of 11.17 MPa, and a specific modulus of 81.03 MPa cm3 g-1 was successfully achieved. Benefitting from the formation of ultra-strong network backbones, foams showed excellent thermal-insulating properties and temperature resistance. The robust porous material with thermal-insulating properties (0.0481 W m-1 K-1) exhibited a compression modulus of 4.21 MPa after heat treatment at 300 degrees C and maintained 91% strength retention, thus it can be used as lightweight heat-insulation composite sandwich structures up to 300 degrees C. The copolymer foam obtained by using 30 mol% flexible blocks reserves its high flexibility undergoing only 10% dimensional changes after 40,000 compression-release cycles. The lightweight thermoplastic PI foams with flexibility, thermalinsulating properties, and temperature resistance can be used for high-temperature lightweight composite sandwich structures in aeronautics and space exploration.

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