Sawing characteristics of diamond wire cutting sapphire crystal based on tool life cycle

Diamond wire saw cutting technology has been widely used in the slicing of sapphire crystal. The ultra-high hardness of sapphire makes the sawing characteristics of diamond saw wire constantly change. At present, there is a lack of in-depth understanding about the influence of sawing characteristics on the quality of sapphire as-sawn wafer, which leads to the unreasonable matching between the process parameters and the sawing characteristics of the saw wire, and reduces the as-sawn wafer quality and the saw wire life. In this paper, the slicing sapphire crystal experiment was carried out with constant process parameters and the variation of saw wire bow angle, nominal diameter and saw kerf loss, surface morphology and surface roughness of the as-sawn wafer during the whole life cycle of the saw wire from initial cutting to breakage was studied. The evolution mechanism of wear and sawing characteristics in the whole life cycle of saw wire was explored, and a reasonable processing scheme which can match the sawing characteristics was put forward. The research results show that in the whole life cycle of the saw wire, the abrasives emerge from the plating layer in turn, then the cutting edge are blunted, and finally the abrasives are greatly flattened and a small amount of falling off. Saw wire has experienced initial wear, stable wear and sever wear, and the proportion of three stages in the whole life cycle is about 0.3: 0.6: 0.1. Compared with the initial stage of wear and the late stage of rapid wear, the saw wire has higher sawing characteristics and better as-sawn wafer quality in the middle stable wear period. The sawing characteristics of new saw wire is relatively weak at the beginning of cutting, so the feed speed of workpiece should be increased gradually from low to high; When most of the abrasives finish sharpening edge, a relatively stable and high feed speed can be adopted; When the abrasives are obviously flattened or fall off, the feed speed should be decreased to accommodate the significantly reduced. cutting performance of diamond saw wire.

Automated summary

The study found that throughout the entire life cycle of the saw wire, it goes through initial wear, stable wear, and severe wear stages, with the saw wire exhibiting higher sawing characteristics and better as-sawn wafer quality during the middle stable wear period. The cutting performance of the new saw wire is relatively weak at the beginning, requiring a gradual increase in feed speed for the workpiece; a relatively stable and high feed speed can be adopted when most abrasives have sharpened edges, while a decreased feed speed is needed when abrasives are noticeably flattened or falling off to accommodate the reduced cutting performance of the diamond saw wire.