期刊
CARBON
卷 186, 期 -, 页码 9-18出版社
PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.carbon.2021.09.068
关键词
Metallized foam; Reduced graphene oxide; One-step thermal treatment; Conductive hybrid; Electromagnetic interference shielding
资金
- National Natural Science Foundation of China [62074154]
- Guangdong Basic and Applied Basic Research Fund [2020A1515110962, 2020A1515110154]
- Shenzhen Basic Research Plan [JCYJ20180507182530279]
- SIAT Innovation Program for Excellent Young Researchers [E1G035]
The lightweight silver/reduced graphene oxide-coated carbonized melamine foam shows remarkable mechanical performance and outstanding EMI shielding effectiveness. The EMI SE reaches 50.6 dB at a density of 16 mg cm(-3), with high absorption coefficient and shielding mechanism.
Endowing electromagnetic interference (EMI) shielding foams with ultralow density and dynamic stable structure is crucial yet challenging. Here, we propose a facile one-step thermal treatment strategy to fabricate lightweight silver/reduced graphene oxide-coated carbonized melamine (CMF/rGO/Ag) hybrid foams with remarkable mechanical performance and outstanding EMI shielding effectiveness (EMI SE). Due to interfacial reinforcement of rGO between CMF skeleton and silver, the CMF/rGO/Ag foams show outstanding structural stability after 1000 cycles of a loading-unloading compression test. Moreover, The EMI SE of the foams reaches 50.6 dB at a mere density of 16 mg cm(-3). The normalized surface-specific SE is up to 7616 dB cm(2) g(-1) with an ultralow Ag content of 0.09 vol%. Interestingly, the collaboration of the porous skeleton and multiple interfaces contribute to an anomalous high absorption coefficient of CMF/ rGO/Ag foams (over 0.5). The high-absorption-coefficient shielding mechanism of the CMF/rGO/Ag foams was further studied by finite element analysis (FEA). The remarkable near-field EMI shielding performance of the CMF/rGO/Ag foam demonstrates that the low density and robust CMF/rGO/Ag foam have enormous advantages and wide application prospects as EMI shielding materials of electronic packaging. (C) 2021 Elsevier Ltd. All rights reserved.
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