Hybrid III-V Silicon Photonic Integrated Circuits for Optical Communication Applications

This paper summarizes recent advances of integrated hybrid InP/silicon-on-insulator lasers and transmitters based on a wafer bonding technique. First, directly modulated hybrid III-V/Si tunable lasers integrated with an external ring resonator filter are demonstrated, enabling the improvement of the dynamic extinction ratio. An efficient tunable filter is then reported mainly for access applications. Finally, results on integrated distributed feedback laser and electro-absorption modulator at 1.3 mu m are presented, showing the capability of operation up to 32 Gb/s. Meanwhile, an integrated tunable laser with an electro-absorption modulator is demonstrated at 1.5 mu m, exhibiting excellent bit-error-rate performance at 10 Gb/s.