4.7 Article

In situ transmission electron microscopy investigation of electroplasticity in single crystal nickel

期刊

ACTA MATERIALIA
卷 223, 期 -, 页码 -

出版社

PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.actamat.2021.117461

关键词

in situ TEM; Nanomechanical test; Electroplasticity; Primary dislocation; Slip band; Surface dislocation nucleation

资金

  1. US Office of Naval Research [N00014-17-1-2283]
  2. Office of Science , Office of Basic Energy Sciences, of the U.S. Department of Energy [DE-AC02-05CH11231]

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The study utilized in situ TEM to observe nanostructural changes in single crystal nickel under mechanical and electrical stimuli to elucidate the mechanisms of electroplasticity. Findings indicate that pulsed electrical current delays stress concentration formation and leads to more uniform plasticity deformation.
In situ Transmission Electron Microscopy ( in situ TEM) tensile tests of single crystal nickel were performed in order to correlate direct observations of nanostructural changes resulting from applied mechanical and electrical stimuli in an effort to provide clarity on the mechanisms of electroplasticity (EP). A dual-tensile geometry was tested with an electrical push-to-pull device (EPTP) and digital image correlation (DIC) was used to track the location of dislocation nucleation along the sample surface. By analyzing the change in sample geometry precisely we are able to directly track individual dislocation motion as a result of the combined electromechanical actuation. From our observations, the pulsed electrical current leads to a more uniform deformation as compared to purely mechanically triggered plasticity. When the sample is undergoing stable plastic deformation, the pulsed current delays the formation of a stress concentration and distributes the deformation more uniformly. Our analysis finds that enhancement of surface nucleation from the electron wind force is more likely than Joule heating to be the origin of the more uniform plasticity observed during electrical pulsing. (c) 2021 The Author(s). Published by Elsevier Ltd on behalf of Acta Materialia Inc. This is an open access article under the CC BY-NC-ND license ( http://creativecommons.org/licenses/by-nc-nd/4.0/ )

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