期刊
ACS APPLIED MATERIALS & INTERFACES
卷 14, 期 6, 页码 8146-8156出版社
AMER CHEMICAL SOC
DOI: 10.1021/acsami.1c21633
关键词
conductive inks; copper-nickel complex inks; copper@nickel core-shell structures; self-organized process; photonic sintering; oxidation resistance; printed flexible electronics
资金
- Ministry of Education, Culture, Sport, Science, and Technology of Japan [26286040, 17H02769]
- Fundamental Research Funds for the Central Universities [JUSRP121043]
- Jiangsu Shuangchuang Talent Program [JSSCBS20210826]
- New Energy and Industrial Technology Development Organization (NEDO), Japan
- Lab and Equipment Management of Jiangnan University [JDSYS201906]
- Grants-in-Aid for Scientific Research [26286040, 17H02769] Funding Source: KAKEN
Rapidly customizable and stable copper-nickel complex inks have been developed, which can transform into uniform copper-nickel core-shell nanostructures during low-temperature annealing and immediately sinter into copper-nickel alloy patterns under photon irradiation. The complex inks are particle-free, stable, and compatible with large-area screen printing. The printed copper-nickel alloy patterns exhibit high conductivity and oxidation resistance, and also maintain flexibility, making them suitable for additive manufacturing of highly reliable flexible electronics.
Cost-effective copper conductive inks are considered as the most promising alternative to expensive silver conductive inks for use in printed electronics. However, the low stability and high sintering temperature of copper inks hinder their practical application. Herein, we develop rapidly customizable and stable copper-nickel complex inks that can be transformed in situ into uniform copper-nickel core-shell nanostructures by a self-organized process during low-temperature annealing and immediately sintered under photon irradiation to form copper-nickel alloy patterns on flexible substrates. The complex inks are synthesized within 15 min via a simple mixing process and are particle-free, air-stable, and compatible with large-area screen printing. The manufactured patterns exhibit a high conductivity of 19-67 mu Omega.cm, with the value depending on the nickel content, and can maintain high oxidation resistance at 180 degrees C even when the nickel content is as low as 6 wt %. In addition, the printed copper-nickel alloy patterns exhibit high flexibility as a consequence of the local softening and mechanical anchoring effect between the metal pattern and the flexible substrate, showing strong potential in the additive manufacturing of highly reliable flexible electronics, such as flexible radio-frequency identification (RFID) tags and various wearable sensors.
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