期刊
ACS APPLIED NANO MATERIALS
卷 4, 期 8, 页码 7538-7562出版社
AMER CHEMICAL SOC
DOI: 10.1021/acsanm.1c01408
关键词
fibers; direct ink writing; 3D printing; nanoparticles; alignment; nanocomposites
资金
- U.S. National Science Foundation [EAGER 1902172]
Additive manufacturing has seen significant growth in recent decades, with extrusion-based direct ink writing (DIW) standing out for its material choices, design flexibility, and cost efficiency. This technology has broad applications in various fields, from intelligent robotics to biomedical implants, showing great potential for further development and innovation.
The field of additive manufacturing (AM) has witnessed spectacular growth in the past 4 decades because of its revolutionary processing mechanism in combining bottom-up and top-down approaches. Many have speculated that it will challenge traditional fabrication methods as the fourth industrial revolution. Among the subfields of three-dimensional (3D) printing, extrusion-based direct ink writing (DIW) is known for its vast material choices, high design flexibility, and acceptable cost efficiency to print many urgently demanded material systems, such as hydrogels or aerogels, nanoparticle suspensions, composite mixtures, liquid crystals, and liquid metals. Furthermore, the DIW's ability to construct complex architectures or hierarchies also contributes to broader applications across different fields, including intelligent robotics, energy generation and storage devices, biomedical implants, and sustainability systems. This review provides a comprehensive summary of recent advances in DIW development, focusing on engineered patterns at different scales, namely, nanoparticle alignment, one-dimensional (1D) fiber microstructure manipulation, and macroscale two-dimensional (2D)/3D spatial patterning. It highlights the hierarchies from nanoscale particle orientations to macroscale long-range-ordered structures. Finally, technical barriers and significant challenges prohibiting DIW for broader applications or impeding fundamental research to industrial commercialization are discussed.
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