期刊
CASE STUDIES IN THERMAL ENGINEERING
卷 25, 期 -, 页码 -出版社
ELSEVIER
DOI: 10.1016/j.csite.2021.100906
关键词
Microstructured wettability pattern; Nanostructured wick; Ultrathin vapor chamber; Thermal resistance; Effective thermal conductivity
资金
- Research Grants Council and Innovation Technology Commission (ITC) of the Government of Hong Kong Special Administrative Region (HKSAR)
- RGC/GRF [16205018, ITS/162/16FP]
- International Science and Technology Project of Huangpu District of Guangzhou City [2019GH02]
The study investigated the thermal performance of a novel wettability patterned evaporator in an ultrathin vapor chamber. The results showed that the wettability pattern greatly reduced horizontal thermal resistance and improved temperature uniformity across the condenser side at a certain heat flux, leading to a substantial increase in effective thermal conductivity.
We investigated the thermal performance of a novel wettability patterned evaporator for an ultrathin vapor chamber. Because the evaporator integrates a wettability patterned substrate underneath the nanostructured mesh wick which can pin the three-phase contact lines on the hydrophilic/hydrophobic boundaries, it enlarges the area of thin-film evaporation. Microstructured wettability pattern is fabricated on the evaporator surface and the wick is pressed onto the evaporator by a micropillar array to make an intimate contact with each other. The micropillar array electroplated on the inner side of the condenser also supports a vapor core as a vapor flow path. The thermal resistance of the ultrathin vapor chamber is experimentally evaluated, and the measurement results show that the wettability pattern underneath the nanostructured mesh wick can greatly reduce the horizontal thermal resistance, giving a better temperature uniformity across the condenser side, though the vertical thermal resistance may be slightly larger than that without a wettability pattern. The highest in-plane effective thermal conductivity of a 200 mu mthick vapor chamber can reach 11914.9 W/(m.K) at 23.91 W/cm(2) heat flux, which shows a 210.7% further improvement in comparison with that of the ultrathin vapor chamber with the nanostructured mesh wick only.
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