4.7 Article

Trap-Assisted Dopant Compensation Prevents Shunting in Poly-Si Passivating Interdigitated Back Contact Silicon Solar Cells

期刊

ACS APPLIED ENERGY MATERIALS
卷 4, 期 10, 页码 10774-10782

出版社

AMER CHEMICAL SOC
DOI: 10.1021/acsaem.1c01775

关键词

silicon photovoltaics; passivating contacts; interdigitated back contacts; device simulation; dopant compensation

资金

  1. US DOE EERE under the Photovoltaic Research and Development (PVRD) program of the Solar Energy Technology Office [DE-EE0007553]
  2. U.S. Department of Energy (DOE) [DE-AC36-08GO28308]
  3. U.S. Department of Energy Office of Energy Efficiency and Renewable Energy Solar Energy Technologies Office

向作者/读者索取更多资源

Utilizing a trap-assisted compensation model, the study explains how polycrystalline Si passivating contacts achieve low leakage current in IBC monocrystalline Si solar cells through dopant compensation between the doped fingers. Analysis of dopant distribution in the isolation region reveals a well-compensated area between the doped fingers, preventing shunting losses. The compensation mechanism widens the compensated region significantly, resulting in a high-resistivity area and low shunt current, as demonstrated by simulations and measurements.
Using a trap-assisted compensation model, we explain why polycrystalline Si (poly-Si) passivating contacts are able to achieve low leakage current between the doped fingers of interdigitated back contact (IBC) monocrystalline Si solar cells despite mixing of boron and phosphorus dopants in the isolation region. The fill factor of IBC solar cells is strongly affected by the electrical isolation region between n- and p-type fingers, as this region is critical in minimizing shunting losses. During fabrication of monocrystalline Si solar cells with poly-Si passivating contacts, the intrinsic poly-Si isolation region inevitably gets contaminated with both p- and n-type dopants. Using dopant profiles measured with time-of-flight secondary ion mass spectrometry and scanning probe measurements of the isolation region, we demonstrate that despite the dopant spreading during cell processing, a wellcompensated region between the doped fingers exists that prevents shunting. The trap-assisted dopant compensation mechanism significantly widens the compensated region to tens of microns, where the residual dopant densities are below the trap density. This enables a high-resistivity region, resulting in low shunt current. Using one-dimensional (1-D) finite element diode simulations, we identify the design parameters and experimental conditions under which a sufficiently resistive region can form. Our measurements of 2-D local resistivity and work function maps across the isolation region using scanning spreading resistance microscopy and Kelvin probe force microscopy demonstrate the existence of a highly resistive, wide compensated region and confirm our proposed compensation mechanism. For our structures, this region is similar to 25 mu m in width within a similar to 150 mu m wide finger isolation region with nearly 3 orders of magnitude higher resistivity than the regions dominated by a single type of dopant.

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