相关参考文献
注意：仅列出部分参考文献，下载原文获取全部文献信息。Investigation of Pillar-Concave Structure for Low-Temperature Cu-Cu Direct Bonding in 3-D/2.5-D Heterogeneous Integration
Tzu-Chieh Chou et al.
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY (2020)
Microsystems using three-dimensional integration and TSV technologies: Fundamentals and applications
Zheyao Wang
MICROELECTRONIC ENGINEERING (2019)
Mass-Spectrometric Observation of Counter Anion Production in SU-8 Exposed to UV Light and its Use for Dill C Parameter Determination
Carlos Raimundo Andrade Lima et al.
JOURNAL OF POLYMER SCIENCE PART B-POLYMER PHYSICS (2019)
Fabrication of sharp silicon hollow microneedles by deep-reactive ion etching towards minimally invasive diagnostics
Yan Li et al.
MICROSYSTEMS & NANOENGINEERING (2019)
A novel microscale selective laser sintering (μ-SLS) process for the fabrication of microelectronic parts
Nilabh K. Roy et al.
MICROSYSTEMS & NANOENGINEERING (2019)
PRODUCING VIAS IN PHOTOSENSITIVE POLYIMIDE PASSIVATION LAYERS FOR FAN OUT PLP THROUGH THE INTEGRATION OF AN ADVANCED LITHOGRAPHY SYSTEM WITH A NOVEL NOZZLE-LESS SPRAY COATING TECHNOLOGY
Stuart Erickson et al.
2019 INTERNATIONAL WAFER LEVEL PACKAGING CONFERENCE (IWLPC) (2019)
Comprehensive Simulations for Ultraviolet Lithography Process of Thick SU-8 Photoresist
Zai-Fa Zhou et al.
MICROMACHINES (2018)
Fabrication of 3D air-core MEMS inductors for very-high-frequency power conversions
Hoa Thanh Le et al.
MICROSYSTEMS & NANOENGINEERING (2018)
A Hybrid Non-destructive Measuring Method of Three-dimensional Profile of Through Silicon Vias for Realization of Smart Devices
Heulbi Ahn et al.
SCIENTIFIC REPORTS (2018)
Three-Dimensional Integrated Circuit (3D IC) Key Technology: Through-Silicon Via (TSV)
Wen-Wei Shen et al.
NANOSCALE RESEARCH LETTERS (2017)
Three-Dimensional Integrated Circuit (3D IC) Key Technology: Through-Silicon Via (TSV)
Wen-Wei Shen et al.
NANOSCALE RESEARCH LETTERS (2017)
Inkjet printing technology for increasing the I/O density of 3D TSV interposers
Behnam Khorramdel et al.
MICROSYSTEMS & NANOENGINEERING (2017)
A user-friendly guide to the optimum ultraviolet photolithographic exposure and greyscale dose of SU-8 photoresist on common MEMS, microsystems, and microelectronics coatings and materials
Matthieu Gaudet et al.
ANALYTICAL METHODS (2017)
High-aspect-ratio photoresist processing for fabrication of high resolution and thick micro-windings
Ricky Anthony et al.
JOURNAL OF MICROMECHANICS AND MICROENGINEERING (2016)
Panel Level Advanced Packaging
Roger McCleary et al.
2016 IEEE 66TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) (2016)
Aqueous-based thick photoresist removal for bumping applications
John C. Moore et al.
ADVANCES IN PATTERNING MATERIALS AND PROCESSES XXXII (2015)
A simulation model on photoresist SU-8 thickness after development under partial exposure with reflection effect
Yuan-Te Huang et al.
JAPANESE JOURNAL OF APPLIED PHYSICS (2014)
Large scale three-dimensional simulations for thick SU-8 lithography process based on a full hash fast marching method
Zai-Fa Zhou et al.
MICROELECTRONIC ENGINEERING (2014)
Review of Integrated Magnetics for Power Supply on Chip (PwrSoC)
Cian O. Mathuna et al.
IEEE TRANSACTIONS ON POWER ELECTRONICS (2012)
Manipulation of exposure dose parameters to improve production of high aspect ratio structures using SU-8
R. Daunton et al.
JOURNAL OF MICROMECHANICS AND MICROENGINEERING (2012)
Simulation Tools for Advanced Mask Aligner Lithography
Arianna Bramati et al.
OPTICAL DESIGN AND ENGINEERING IV (2011)
Proximity Lithography in Sub-10 Micron Circuitry for Packaging Substrate
Fengtao Wang et al.
IEEE TRANSACTIONS ON ADVANCED PACKAGING (2010)
Modeling, simulation and experimental verification of inclined UV lithography for SU-8 negative thick photoresists
Zhen Zhu et al.
JOURNAL OF MICROMECHANICS AND MICROENGINEERING (2008)
Novel exposure methods based on reflection and refraction effects in the field of SU-8 lithography
WJ Kang et al.
JOURNAL OF MICROMECHANICS AND MICROENGINEERING (2006)
Variation of absorption coefficient and determination of critical dose of SU-8 at 365 nm
M Gaudet et al.
APPLIED PHYSICS LETTERS (2006)
Simulation of deep UV lithography with SU-8 resist by using 365 nm light source
X Tian et al.
MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS (2005)
Enhanced Dill exposure model for thick photoresist lithography
SJ Liu et al.
MICROELECTRONIC ENGINEERING (2005)
Investigation of gray-scale technology for large area 3D silicon MEMS structures
CM Waits et al.
JOURNAL OF MICROMECHANICS AND MICROENGINEERING (2003)
Reduction of diffraction effect of UV exposure on SU-8 negative thick photoresist by air gap elimination
YJ Chuang et al.
MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS (2002)
分享论文
