4.8 Article

Ambipolar inverters based on cofacial vertical organic electrochemical transistor pairs for biosignal amplification

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SCIENCE ADVANCES
卷 7, 期 37, 页码 -

出版社

AMER ASSOC ADVANCEMENT SCIENCE
DOI: 10.1126/sciadv.abh1055

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资金

  1. King Abdullah University of Science and Technology Office of Sponsored Research (OSR) [OSR-2018-CARF/CCF-3079, OSR-2019-CRG8-4086]
  2. Soft and Hybrid Nanotechnology Experimental (SHyNE) Resource (NSF) [ECCS-1542205]
  3. Materials Research Science and Engineering Centers (MRSEC) [DMR-1720139]
  4. State of Illinois
  5. Northwestern University
  6. SHyNE Resource (NSF) [ECCS-1542205]
  7. MRSEC program (NSF) at the Materials Research Center [DMR-1720139]
  8. International Institute for Nanotechnology (IIN)
  9. Keck Foundation
  10. State of Illinois, through the IIN

向作者/读者索取更多资源

The study introduces an active sensing node and inverter based on OECTs for signal amplification in bioelectronic sensing, providing new opportunities to improve signal quality and reduce the burden of signal transmission, while also demonstrating compatibility with nontraditional fabrication methods.
On-site signal amplification for bioelectronic sensing is a desirable approach to improving recorded signal quality and to reducing the burden on signal transmission and back-end electronics. While organic electrochemical transistors (OECTs) have been used as local transducers of bioelectronic signals, their current output presents challenges for implementation. OECT-based circuits offer new opportunities for high-performance signal processing. In this work, we introduce an active sensing node based on cofacial vertical OECTs forming an ambipolar complementary inverter. The inverter, which shows a voltage gain of 28, is composed of two OECTs on opposite side walls of a single active area, resulting in a footprint identical to a planar OECT. The inverter is used as an analog voltage preamplifier for recording electrocardiogram signals when biased at the input voltage corresponding to peak gain. We further demonstrate compatibility with nontraditional fabrication methods with potential benefits for rapid prototyping and large-area printed electronics.

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