期刊
JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T
卷 13, 期 -, 页码 1980-1991出版社
ELSEVIER
DOI: 10.1016/j.jmrt.2021.06.002
关键词
Deformation mechanism; Crystallographic orientation; 6.5 wt.% Si electrical strip; Twin-roll thin strip casting process
资金
- Ministry of Education of China [N170708019]
- National Natural Science Foundation of China [51801022]
- Taiyuan University of Science and Technology Scientific Research Initial Funding, China [20182007]
The study aims to investigate the deformation mechanisms involved in Twin-roll Thin Strip Casting Process for high-permeability 6.5 wt.% Si electrical strip. Using crystal plasticity theory and VPSC model, the activation of single and multi-slip systems during deformation is analyzed to understand the evolution of crystallographic orientations. The proposed CP-based method serves as a reference for studying deformation behavior in other semi-solid forming processes.
The study described here is aimed at illuminating deformation mechanism involved in Twin-roll Thin Strip Casting Process (TRSC) with respect to high-permeability 6.5 wt.% Si electrical strip (6.5 wt.% Si strip) in terms of crystal plasticity (CP) theory, and a Visco-plastic Self-consistent model (VPSC) was utilized to explore the deformation mechanism by applying crystallographic orientation (OR) analysis. Results underscore that the acti-vation of overall potential single slip system with regard to studied 6.5 wt.% Si strip including {110} <111>, {112} <111> as well as {123} <111> can contribute to the OR conversion from Cube texture to Rotated-Cube texture, alpha-fiber texture as well as gamma-fiber texture, while with different evolution rate during deformation. The potential multi-slip system of {112} <111> + {123} <111> with average number of activated slip system per grain-9.1-9.4, and multi-slip system of {110} <111> + {112} <111> +{123} <111> with average number of activated slip system per grain similar to 10.4-10.8 are identified to be the predominant slip systems during deformation by comparing to the actual OR features obtained from TRSC-processed 6.5 wt.% Si strip. The CP-based method proposed in present study is deemed as a reference to investigate deformation behavior involved in the other semi-solid forming process. (C) 2021 The Author(s). Published by Elsevier B.V.
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