期刊
MATERIALS & DESIGN
卷 206, 期 -, 页码 -出版社
ELSEVIER SCI LTD
DOI: 10.1016/j.matdes.2021.109784
关键词
Solid-state refrigeration; Elastocaloric effect (eCE); Shape memory alloys (SMAs); Reduced dimensions materials; Micro cooling
资金
- National Key RAMP
- D Program of China [2017YFB0703103]
Elastocaloric cooling technology, which is more efficient and environmentally friendly than vapor compression systems, has potential applications in miniaturized cooling devices, but challenges need to be addressed to enhance performance.
Elastocaloric cooling technology has obtained huge attraction over vapor compression systems because it is more efficient with negligible environmental impact. The elastocaloric effect (eCE) is generally concerned with superelasticity and latent heat of shape memory alloys (SMAs), related to the martensitic transformation (MT) under uniaxial loading/unloading. There are various small-scale applications such as microelectromechanical systems, medical devices and lab-on-chip systems, where active local cooling with precise temperature control is essential for their proper functioning. To explore potential eCE for miniaturized active refrigeration, reduced dimensions SMAs (i.e. thin films, microwires, ribbons and foams) may be attractive for micro cooling devices by providing a large surface to volume ratio and thus high heat transfer capacity, low thermal hysteresis and high working frequency. Therefore, the eCE properties of the state-of-the-art reduced dimensions elastocaloric materials (eCMs) are thoroughly reviewed and comparatively discussed with their bulk counterparts. The most appropriate eCMs for miniaturized eCE refrigeration are revealed on the basis of large adiabatic temperature change (ATad), low stress hysteresis (Arhys), high cyclic stability and large coefficient of performance of material (COPmat). The challenges and recent achievements for micro cooling eCE devices/prototypes based on small-sized eCMs are summarized.& nbsp; (c) 2021 The Author(s). Published by Elsevier Ltd. This is an open access article under the CC BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/). Superscript/Subscript Available
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