Pool Boiling Performance of Multilayer Micromeshes for Commercial High-Power Cooling

With the rapid development of electronics, thermal management has become one of the most crucial issues. Intense research has focused on surface modifications used to enhance heat transfer. In this study, multilayer copper micromeshes (MCMs) are developed for commercial compact electronic cooling. Boiling heat transfer performance, including critical heat flux (CHF), heat transfer coefficients (HTCs), and the onset of nucleate boiling (ONB), are investigated. The effect of micromesh layers on the boiling performance is studied, and the bubbling characteristics are analyzed. In the study, MCM-5 shows the highest critical heat flux (CHF) of 207.5 W/cm(2) and an HTC of 16.5 W(cm(2)center dot K) because of its abundant micropores serving as nucleate sites, and outstanding capillary wicking capability. In addition, MCMs are compared with other surface structures in the literature and perform with high competitiveness and potential in commercial applications for high-power cooling.

Automated summary

This study developed multilayer copper micromeshes for commercial compact electronic cooling and investigated their boiling heat transfer performance. The MCM-5 showed the highest critical heat flux and heat transfer coefficient due to its abundant micropores serving as nucleate sites and outstanding capillary wicking capability. The micromeshes were also found to perform competitively with other surface structures in high-power cooling applications.