4.7 Article

Experimental Investigation of the Rapid Fabrication of Micron and Submicron Structures on Polymers Utilizing Ultrasonic Assisted Embossing

期刊

POLYMERS
卷 13, 期 15, 页码 -

出版社

MDPI
DOI: 10.3390/polym13152417

关键词

ultrasonic vibration; embossing; micron and submicron structure; impedance-based control

资金

  1. Deutsche Forschungsgemeinschaft (DFG, German Research Foundation) under Germany's Excellence Strategy within the Cluster of Excellence PhoenixD (EXC 2122) [390833453]

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In recent years, small-scale optical components with micron or submicron features have become increasingly popular. There is an urgent need for high-quality, high-efficient, and cost-effective processing approaches for mass production of polymer optics. This study successfully introduced ultrasonic vibration in embossing, allowing for precise control of the embossing process and achieving a uniform embossed surface with a fill rate of over 75% in a matter of seconds.
Small-scale optical components with micron or submicron features have grown in popularity in recent years. High-quality, high-efficient, and cost-effective processing approaches for polymer optics mass production are an urgent need. In this study, ultrasonic vibration will be introduced in embossing. The major advantage is that the required energy can be provided for process times ranging from a few hundred milliseconds to a few seconds, and that the process energy is provided at exactly the required location so that the structures in the surrounding area are not affected. Due to the strong correlation between electrical impedance and the temperature of the material, a novel impedance-based control strategy has been utilized for precisely controlling ultrasonic vibration during the embossing process. The investigation used two types of stamps with grating line widths of 4 mu m and 500 nm, respectively. As a result, an embossing time of less than a few seconds was accomplished and a uniform embossed surface with an average fill rate of more than 75% could be achieved.

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