4.4 Article

A novel chronic wound biofilm model sustaining coexistence of Pseudomonas aeruginosa and Staphylococcus aureus suitable for testing of antibiofilm effect of antimicrobial solutions and wound dressings

期刊

WOUND REPAIR AND REGENERATION
卷 29, 期 5, 页码 820-829

出版社

WILEY
DOI: 10.1111/wrr.12944

关键词

biofilm; coexistence of Pseudomonas aeruginosa and; Staphylococcus aureus; model; test of antibiofilm effect

资金

  1. China Scholarship Council

向作者/读者索取更多资源

Chronic wound biofilm infections play a crucial role in hindering wound healing, making it essential to study and develop effective interventions against biofilm. A novel in vitro biofilm model that mimics infected chronic wounds has been introduced, sustaining the coexistence of pathogens for at least 96 hours. Testing with antimicrobial solutions and dressings containing silver or honey showed moderate-to-low antibiofilm effects, aligning better with observed clinical performance compared to standard tests.
Chronic wounds are a large burden to patients and healthcare systems. Biofilm infections in chronic wounds are crucial factors leading to non-healing of wounds. It is important to study biofilm in wounds and to develop effective interventions against wound biofilm. This study presents a novel in vitro biofilm model mimicking infected chronic wounds. The novel layered chronic wound biofilm model uses woundlike media and includes both Pseudomonas aeruginosa and Staphylococcus aureus, which have been identified as the most important pathogens in wounds. The model sustains their coexistence for at least 96 h. Microscopy of the model revealed microbial growth in non-surface attached microcolonies as previously observed in vivo. The model was used to determine log(10)-reduction for the use of an antimicrobial solution and antimicrobial dressings (containing silver or honey) showing moderate-to-low antibiofilm effect, which indicates better concordance with the observed clinical performance of this type of treatment than other widely used standard tests.

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