Piezoresistive bond lines for timber construction monitoring-experimental scale-up

Several laboratory studies and experiments have demonstrated the usability of polymer films filled with electrically conductive filler as piezoresistive material. Applied to adhesives, the glue lines of wood products can achieve multifunctional-thus bonding and piezoresistive/strain sensing-properties. Based on critical load areas in timber constructions, upscaled test setups for simplified load situations were designed, especially with regard to a stress-free electrical contact. In a second step, another upscaling was done to small glulam beams. Based on an experimental test sequence, the piezoresistive reactions as well as the behaviour until failure were analysed. The results show in all cases that a piezoresistive reaction of the multifunctionally bonded specimens was measurable, giving a difference in the extent of relative change. Additionally, measured phenomena like inverse piezoresistive reactions, electrical resistance drift and the absence of a piezoresistive reaction were discussed, based on additional strain analysis by digital image correlation. A model of macroscopic and microscopic strains influencing the piezoresistive reaction of the electrically conductive bond line in wood was used to explain all experimental results. Finally, a first scale-up of piezoresistive bond lines from laboratory samples to glulam beams was possible and successful.

Automated summary

Laboratory studies have shown that polymer films filled with electrically conductive filler can be used as piezoresistive material in adhesive applications for wood products, achieving multifunctional bonding and piezoresistive/strain sensing properties. Upscaled test setups were designed for simplified load situations in timber constructions, with a focus on stress-free electrical contact.