4.7 Article

Post-annealing effect on the electrochemical behavior of nanostructured magnetron sputtered W3O films in chloride- and acid-containing environments

期刊

SURFACE & COATINGS TECHNOLOGY
卷 420, 期 -, 页码 -

出版社

ELSEVIER SCIENCE SA
DOI: 10.1016/j.surfcoat.2021.127334

关键词

Tungsten oxides; Corrosion; PVD coatings; Nanostructured thin films; Magnetron sputtering

资金

  1. King Fahd University of Petroleum and Minerals (KFUPM, Dhahran, Saudi Arabia)
  2. Deanship of Scientific Research (DSR) at King Fahd University of Petroleum and Minerals (KFUPM) [DF191020]

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The study demonstrates that tungsten oxide thin films exhibit optimal protective properties at an annealing temperature of 400 degrees C, with excellent corrosion resistance in both chloride and sulfuric acid environments.
In this study, magnetron sputtered tungsten oxide (W3O) thin films were deposited on stainless steel 316L substrates followed by annealing treatment at different temperatures (200 to 800 degrees C). The synthesized films were characterized and thereafter investigated for their corrosion resistance behavior, in both 3.5% NaCl and 0.5 M H2SO4 environments, using electrochemical corrosion techniques. FESEM, XRD, and XPS analyses revealed that the oxygen content increases with annealing temperature, which then results in morphological and microstructural changes from cubic nanorods to monoclinic nanoplatelets and nanopyramids, composing of mixed oxidation states (WO(2.72 )and WO2.92). Electrochemical impedance and potentiodynamic measurements showed that in the chloride-containing solution the resistance increases with the annealing temperature until an optimum temperature of 400 degrees C. Similarly, the as-deposited and the films annealed at temperatures up to 400 degrees C demonstrated better protectiveness that exceeds 95%, in the acidic environment. The passive current densities and the pitting potentials of the films were likewise improved in both environments. Findings in this investigation suggest that an annealing temperature of 400 degrees C induced optimum protective barrier properties to the film.

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