期刊
SMALL
卷 17, 期 52, 页码 -出版社
WILEY-V C H VERLAG GMBH
DOI: 10.1002/smll.202102903
关键词
covalent interaction; fiber; surface modification; wearable electronics; pi-pi stacking
类别
资金
- Henry Royce Institute for Advanced Materials through EPSRC [EP/R00661X/1, EP/P025021/1, EP/P025498/1]
- Short Research Visits UK Fluids Network [EP/N032861/1]
- EPSRC [EP/P025021/1] Funding Source: UKRI
This article reviews the current research status and practical applications of surface/interface engineering techniques on fiber materials, introducing a new self-assembly method and the promising candidacy of metal-oxide framework fibers in wearable electronics. It advances the understanding of surface/interfacial engineering on fiber materials and is expected to guide the rational design of future fiber-based wearable electronics.
Surface/interfacial engineering is an essential technique to explore the fiber materials properties and fulfil new functionalities. An extensive scope of current physical and chemical treating methods is reviewed here together with a variety of real-world applications. Moreover, a new surface/interface engineering approach is also introduced: self-assembly via pi-pi stacking, which has great potential for the surface modification of fiber materials due to its nondestructive working principle. A new fiber family member, metal-oxide framework (MOF) fiber shows promising candidacy for fiber based wearable electronics. The understanding of surface/interfacial engineering techniques on fiber materials is advanced here and it is expected to guide the rational design of future fiber based wearable electronics.
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