期刊
PROGRESS IN ORGANIC COATINGS
卷 157, 期 -, 页码 -出版社
ELSEVIER SCIENCE SA
DOI: 10.1016/j.porgcoat.2021.106309
关键词
Parylene C; PDMS; Parylene C-deposited PDMS; Parylene C-filled PDMS; Mixed interfacial analysis; Soft bioelectronics
资金
- National Research Foundation (NRF) of Korea [NRF-2017M3A9E2056463, NRF-2020R1A2C2008833]
- National Research Foundation of Korea [2017M3A9E2056463] Funding Source: Korea Institute of Science & Technology Information (KISTI), National Science & Technology Information Service (NTIS)
The study focused on the microcracks in Parylene C-filled PDMS substrates, analyzing the phenomenon by quantifying the penetration depth, the amount of Parylene C on the surface and in the interfacial region. It was found that only etching the Parylene C from the PDMS surface was the optimal condition for fabricating the filled PDMS substrate.
Parylene C-modified polydimethylsiloxane (PDMS) substrates such as parylene C-deposited PDMS and parylene C-filled PDMS have been developed for the microfabrication of soft electronic devices with mechanically and electrically stable metal patterns. In previous studies, we performed oxygen plasma etching to etch parylene C away from the PDMS surface of parylene C-deposited PDMS to maximize the benefits of soft and stretchable properties of PDMS. However, the resultant parylene C-filled PDMS exhibited microcracks during thin film metal patterning as the etching time increased. In this study, to analyze this cracking phenomenon precisely, the penetration depth of parylene C into PDMS was quantitatively investigated according to the thickness of deposited parylene C, and the amount of parylene C on the surface as well as in the interfacial region formed by parylene C and PDMS was analyzed depending on the etching time. It was observed that residual parylene C remained in the PDMS pores even after parylene C was etched away from the PDMS surface. In addition, we confirmed that only the amount of parylene C on the PDMS surface was reduced by excessive etching, and parylene C inside the PDMS pores was not significantly affected. From these results, we could confirm that the optimal condition to fabricate the parylene C-filled PDMS substrate was to etch parylene C just from the surface of PDMS without over-etching. The parylene C-filled PDMS substrate would enable the wafer-scale high-yield fabrication of soft bioelectronics for diverse applications.
作者
我是这篇论文的作者
点击您的名字以认领此论文并将其添加到您的个人资料中。
推荐
暂无数据