Effect of temperature on the SU-8 photoresist filling behavior during thermal nanoimprinting

SU-8 photoresist is an ideal thermal-imprinting polymer, which has been widely used in micro-nano devices in recent years. However, the research on the filling behavior of SU-8 photoresist during thermal nanoimprinting is not complete. In this paper, the stress relaxation curves and shear stress/rate flow curves were measured to analyze the temperature dependent rheological properties of SU-8 photoresist. The filling behavior of SU-8 photoresist was discussed based on thermal imprinting results at various temperatures. High-precision nanochannels were fabricated with replication error of 2.8% at optimized thermal imprinting temperature of 85 degrees C and duration of 10 min, which paves the way for high-precision fabrication of SU-8-based micro-nanofluidic chips.

Automated summary

This paper investigates the filling behavior of SU-8 photoresist during thermal nanoimprinting by analyzing the temperature-dependent rheological properties and discussing the filling behavior at different temperatures. High-precision nanochannels were successfully fabricated under optimized parameters.